Description:
Specifications:
Board layer: 2
Material: FR-4
Minimum
board thickness: 0.6mm
Minimum line width: 0.25mm
Minimum line spacing: 0.18mm
Minimum hole diameter: 0.5mm
Surface finishing: OSP / Entek / HAL
Packing:
Vacuum
packing Main
export markets:
Eastern Europe, Western Europe, North America, Asia