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2025 HS Laser High Design Picosecond Laser Glass Cutting Machine for Glass Design

Price $165380.00
Min Order 1 Piece
Availability In Stock
Shipping From Guangdong, China
Popularity 415 people viewed
Certification:
CE, FDA
Cutting Method:
Laser Cutting
Maximum Cutting Thickness:
15 mm
Power Supply:
220V
Safety Features:
Emergency Stop Button, Safety Sensor
Product Name:
Picosecond Laser Glass Cutting Machine
Laser Power:
30W 50W 60W 75W 80W
Laser Type:
Picosecond Laser and RF CO2 Laser
Laser Wavelength:
1064±5nm
Working Area:
Standard 600X700mm Double Working Table
Repetition Rate:
Single Shot to 8 MHz
Power Voltage:
Single-Phase 220V±10%, 50/60Hz AC
Working Environment Humidity:
20-26
Control System:
HS Laser (Customized )
CNC Machine Bed:
Plate Sheet Welding
Trademark:
HS LASER
Transport Package:
Wooden Box
Specification:
220V
Origin:
Shenzhen
HS Code:
8515800090
Product Description

HS LASER Picosecond float glass laser cutting macahine
 

Picosecond Laser Glass Cutting Machine: Applications, Compatible Glass Types, and Cutting Parameters

 

1. Core Application Industries

1.1 Consumer Electronics

  • Target Materials:

    • Smartphone/tablet cover glass (e.g., Corning Gorilla Glass, AGC Dragontrail).

    • Curved glass for wearables (e.g., smartwatches, AR/VR lenses).

  • Key Requirements:

    • Ultra-thin glass cutting (0.3-1.1 mm) with anti-cracking technology.

    • High-precision shaped cuts (e.g., camera holes, fingerprint modules) with ±5 μm accuracy.

  • Case Study:

    • A global smartphone manufacturer uses a 20W picosecond laser to cut 0.7 mm microcrystalline glass, achieving edge chipping <10 μm.

1.2 Automotive & Autonomous Driving

  • Target Materials:

    • Curved glass for automotive triple-screen displays (1.5-3 mm thickness).

    • Quartz optical windows for LiDAR systems.

    • HUD projection glass with anti-glare coatings.

  • Technical Edge:

    • 3D dynamic focusing for cutting curved surfaces (radius ≥8 mm).

    • Heat-affected zone (HAZ) <30 μm, critical for optical clarity.

  • Case Study:

    • Automotive uses a 30W system to cut LiDAR-grade fused silica lenses (1.2 mm thickness).

1.3 Advanced Display Manufacturing

  • Mini/Micro LEDCutting 0.2 mm ultra-thin glass substrates (CTE <3.5×10/K) with 2 μm line accuracy.

  • OLED Flexible Screens:

    • Delicate cutting of glass encapsulation layers (50-100 μm) on PI substrates, using pulse energy <10 μJ to prevent delamination.

1.4 Precision Optics

  • High-End Applications:

    • Fluorophosphate optical glass (refractive index: 1.45-1.9) cutting for lenses and prisms.



    • Infrared chalcogenide glass (e.g., Ge28Sb12Se60) for thermal imaging systems.

  • Case Study:

    • UK-based Renishaw utilizes a 25W picosecond laser to cut 80 mm diameter sulfur-basd glass lenses at 300 mm/s.

2. Glass Types & Cutting Parameters Matrix

Glass TypeKey PropertiesRecommended PowerThickness RangeCutting SpeedCritical Configurations
Soda-Lime Glass (Architectural)Hardness: 5.5 Mohs, CTE: 9×10/K30W+0.5-8 mm200 mm/sNassist to prevent edge carbonization
Borosilicate Glass (Labware)Thermal resistance: 560°C, CTE: 3.3×10/K20-30W0.3-5 mm150 mm/sVacuum chuck to minimize thermal warping
Fused Silica (Optical)Purity: 99.99%, Melting point: 1750°C30W+0.1-10 mm80 mm/s532 nm green laser for optimal absorption
Ultra-Thin Electronic GlassThickness: 0.05-0.3 mm, Flexural strength: >800 MPa10-15W0.05-0.5 mm500 mm/sAir-bearing stage to suppress microcracks
Chemically Strengthened GlassSurface compressive stress: >700 MPa15-25W0.3-2 mm300 mm/sBurst mode to penetrate stress layers
 

3. Power vs. Threshold Guidelines

  • General Rule:

    • Power (W) ≈ 2 × Glass Thickness (mm) + 10 (for standard soda-lime glass).

    • Example: 2 mm glass → ~14W minimum power (add 20-50% buffer for complex shapes).

  • Speed Adjustment:

    • For every 0.1 mm thickness increase, reduce speed by 15-20 mm/s (for borosilicate).

 

4. Industry-Specific Technical Highlights

  • Medical Devices (US Market Focus):

    • Cutting 1 mm bioactive glass (e.g., 45S5 Bioglass®) for endoscopic tools with zero toxic byproducts.

  • Aerospace (UK/Germany Focus):

    • 3 mm aluminosilicate glass cutting for aircraft cabin windows (Ra <0.4 μm post-cutting).

  • Renewable Energy (US/Germany):

    • CdTe thin-film solar glass cutting using 20W + fume extraction to prevent Cd release.

       

Model number: HS-Pi50 /HS-Pi60 /HS-Pi75 / HS-Pi80 /HS-Pi90

Power supply:Single-phase 220V±10%, 50/60Hz AC

Laser power:50W 60W 75W 80W 90W

Whole machine power consumption:

Laser type: Picosecond laser and RF co2 laser

Working environment humidity:20-26°C

Laser wavelength: 1064±5nm

Control system:HS LASER (customized )
Support English operation system

Working area: Standard 600x700mm double working table

CNC machine bed:Plate sheet welding 

Repetition Rate:Single Shot to 8 MHz

Working desk:Marble countertop

 Spatial Mode: M^2 < 1.3

Pulse Width Measured at 1064nm: 10 picoseconds

Pointing Stability Over Constant Temperature +/2 °C: < 50 μrad / °C

Machine weight:>5ton

Picosend cutting speed:500mm/s

Laser cutting head:Bessel  

Detailed Photos

 





 
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