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2oz Aluminium OSP Circuit Board for LED PCB

Price $90.00
Min Order 5 Square Meters
Availability In Stock
Shipping From Zhejiang, China
Popularity 281 people viewed
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Model NO.:
Aluminium PCB-7
Type:
Rigid Circuit Board
Flame Retardant Properties:
V0
Dielectric:
Aluminium
Base Material:
Aluminum
Insulation Materials:
Organic Resin
Mechanical Rigid:
Rigid
Material:
Aluminum
Board Thickness:
0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.2mm
Thermal Conductivity:
1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K
Ccl Brand:
Jh,Ccaf.etc
Sample Date:
3-5days
Trademark:
ZAPON
Transport Package:
Vacuum Packing
Specification:
SGS UL ISO
Origin:
China
HS Code:
85340090
Product Description
Product Description:
Aluminum base copper-clad laminate have excellent flame retardant, high mechanical strength, dimensional stability etc. Especially it has very good heat sink, electromagnetic shielding and solder float. 
It's widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc. 
Note: We specially produces Metal Base Copper-Clad Laminates, and our products have been compiled series with all complete specifications. 
The tapy and specification of Aluminum based Laminates CCAF-01, CCAF-04-A, CCAF-05etc. And 0.8mm, 1.0mm, 1.5mm, 2.0mm, etc. 
Thickness of the copper: 18um, 35um, 70um, 105um. 
Base size: 500mm ×, 600mm (20"×, 24"); 600mm ×, 1060mm (24"×, 42") 
CCAF-01 Aluminum-base copper-clad laminate 
The test base: CCAF-01 the high heat dissipation Aluminum-base copper-clad laminate 
Thickness of the copper: 35um 
Thickness of the diclectric: 70um 
Thickness of the aluminum-base: 1.5mm 
nt-size:12.0000pt;mso-font-kerning:1.0000pt;" >
Thickness of the aluminum-base: 1.5mm 
The result of the test:
 Test itemTechnology requestUnitTest result
1Peel StrengthA≥ 1.0N/mm1.05
After thermal stress (260 ordm;C )≥ 1.0N/mm1.05
2Blister test AfterThermal stress (288 ordm;C, 2min)288ordm;C  2 min
No delaminating		/OK
3Themal Resistance≤ 2.0ordm;C /W0.65
4Flammability(A)FV-O/FV-O
5Surface ResistivityA≥ 1 × 10 5M Ω5.0 × 10 7
Constant humidity treatment
(90%,3 5 ordm;C ,96h)		≥ 1 × 10 5M Ω4.5 × 10 6
6
7		Volume ResistivityA≥ 1 × 10 6M Ω@ m1.0 × 10 8
Constant humidity treatment
(90%,3 5 ordm;C ,96h)		≥ 1 × 10 6M Ω@ m1.9 × 10 7
8Dielectric Breakdown (DC )≥ 25Kv/mm31
9Dielectric constant (1MHz)
(40 ordm;C, 93% , 96h)		≤ 4.4/4.2
10Dielectric dissipation factor (1MHz )
(40ordm;C ,93%,96h)		≤ 0.03/0.029
 Accelerated aging experiment
(125 ordm;C ,2000h)		 The laminate bace should no wrinkles,no crack,no delaminating or no pine/OK
11High low temperature impact test
(-50 ordm;C, 15min, 80ordm;C , 15minTOTAL   DO 15 ~ 20 Circulation) 		Peel Strength/N/mm1.39 ~ 1.64
Surface Resistivity/M Ω1.9 × 10 8 ~6.4 × 10 8


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