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Back Grinding Wheels for Semiconductor Wafers Process
| Price | $2500.00 |
|---|---|
| Min Order | 1 Piece |
| Availability | In Stock |
| Shipping From | Henan, China |
| Popularity | 411 people viewed |
Model NO.:
Silicon wafer wheel
Type:
Thinning
Material:
Diamond Abrasive
Application:
Silicon Wafer Back
Effect:
Polishing
Grit Size (JIS):
80#---1000#
Shape:
Cylindrical
Warranty:
1 Years
Service:
7 Days/24 Hours
Feature:
Long Life
Grinding Material:
Cubic Boron Carbide
Customized Support:
OEM, ODM
Bonding Agent:
Vitrified & Resin
Product Name:
Diamond Grinding Wheel
Package:
Wooden Box
Wheel Type:
Angle Grinding Wheels
Bond:
Vitrified & Resin
Wheel Base:
Steel or Aluminium
Trademark:
HT
Transport Package:
Wooden Boxes
Specification:
JB
Origin:
Henan, China
Product Description
Silicon Wafer Back Grinding Wheels
Application areas and scope of application:
It is mainly used for thinning and fine grinding of semiconductor wafers
Features:
1. Excellent grinding performance and high cost performance.
2. lt can be stably used in grinding machines made in Europe, America, Japan and China, and can replace imported products.
It is mainly used for thinning and fine grinding of semiconductor wafers
Features:
1. Excellent grinding performance and high cost performance.
2. lt can be stably used in grinding machines made in Europe, America, Japan and China, and can replace imported products.
Product name | Silicon Wafer Back grinding wheel | OEM | Supported |
Advantage | Good performance | Size | Customized |
Bond | Diamond | Grit size | Customized |
OED | Supported | Package | Woonden box & cartoon box |
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