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Chitherm Htf2550-07 Vacuum Heat Treatment Furnace
| Price | $100000.00 |
|---|---|
| Min Order | 1 Piece |
| Availability | In Stock |
| Shipping From | Anhui, China |
| Popularity | 439 people viewed |
Model NO.:
HTF2550-07
Certification:
ISO
Place Style:
Horizontal
Range of Applications:
Industrial
Type:
Electric Holding Furnace
Usage:
Steel Molding
Fuel:
Electric
Atmosphere:
Vacuum
Effective Dimensions:
Ø250*500mm
Max vacuum Level:
5×10-4PA
Trademark:
Chitherm
Transport Package:
Wooden Packaging
Specification:
1200mm*1700mm*2200mm(W*H*D)
Origin:
China
HS Code:
8514101000
Product Description
Hefei CHITHERM Equipment Co., Ltd. is an advanced equipment supplier specializing in the R&D, design, manufacturing, sales, maintenance and service of industrial heat treatment furnaces and experimental furnaces.
Our products include Bell Furnace, Hot Air Dryer, Box Furnace, Tube Furnace, Vacuum Furnace, Trolley Furnace, Rotary Furnace, Mesh Belt Furnace, Push Plate Furnace, etc. , which are widely used in advanced ceramics, electronic components, thick film circuit, additive manufacturing, powder metallurgy, new energy, photovoltaic and other fields.
It is suitable for the heat treatment process of ITO target, MLCC / HTCC / LTCC, ceramic filter, magnetic material, CIM / MIM, positive and negative electrode of lithium battery, as well as pre firing, glue discharging, degreasing, firing, drying, heat treatment, curing, ceramic metallization and other processes of various new materials.
Our products include Bell Furnace, Hot Air Dryer, Box Furnace, Tube Furnace, Vacuum Furnace, Trolley Furnace, Rotary Furnace, Mesh Belt Furnace, Push Plate Furnace, etc. , which are widely used in advanced ceramics, electronic components, thick film circuit, additive manufacturing, powder metallurgy, new energy, photovoltaic and other fields.
It is suitable for the heat treatment process of ITO target, MLCC / HTCC / LTCC, ceramic filter, magnetic material, CIM / MIM, positive and negative electrode of lithium battery, as well as pre firing, glue discharging, degreasing, firing, drying, heat treatment, curing, ceramic metallization and other processes of various new materials.
Typical applications:
The sintering and annealing process of electronic components, semiconductor wafers, and other related materials in a vacuum environment.
Parameter characteristics:
1. Rated Temp: 500 ºC
2. Max Temp: 700 ºC
3. Tube Material: Fused Silica
4. Effective Dimensions: Ø250 × 500mm (D × H);
5. Temp Uniformity: ± 2 ºC
6. Temp Zones: 3 Zones
7. Temp Zone Length: 300+300+300mm
8. Heat Power: 24kW
9. Insulation Power: <8kW
10. Heating up Speed: <15ºC/min
11. Thermocouple:Type K
12. Process Steps: 9 Steps
13. Max Vacuum Level: 5 × 10-4Pa
14. Working Vacuum Level: 1 × 10-3Pa
15. Vacuum Speed: <60min (up to 5 × 10-4Pa)
16. Alarms: Over temperature, vacuum level, gas air pressure, motor overload, and power lines reversed etc
17. Furnace Dimensions: 1200mm×1700mm×2200mm(W×H×D)
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