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Diamond Single-Wire Saw Cutting Machine for Large Size Sapphire Silicon Processing Tool
| Price | $200000.00 |
|---|---|
| Min Order | 1 set |
| Availability | In Stock |
| Shipping From | Shandong, China |
| Popularity | 432 people viewed |
Model NO.:
DCX800
After-sales Service:
on-Site Installation, Commissioning and Training
Warranty:
12 Months After Acceptance
Condition:
New
Certification:
CE, ISO 9001: 2015
Automation:
Automatic
Suitable for:
Alloy, Sapphire, Quartz Crystal, Silicon, Magnets
Maximum Worksize:
800X800X800mm
Maximum Running Speed:
1200m/Min
Workbench Quantity:
1
Wire Diameter:
0.25-0.60mm
Wire Spool Storage:
40km(0.25mm)
Cutting Method:
Diamond Wire Feeds Parallel or Swinging Downward
Maximum Swing Angle:
±30°
Rotary Cutting:
360° (Optional)
Cutting Fluid:
Water-Based Cutting Fluid or Cutting Oil
Fluid Storage:
130L
Fluid Flow Rate:
180L/Min
Power:
15kw
Dimension:
2510X2700X2500mm
Weight:
5000kg
Test Cut:
Provide Test Cut Service
Trademark:
LiKai
Transport Package:
Wooden Case
Specification:
White
Origin:
China
HS Code:
8464109000
Product Description
DCX800 Single-wire Saw
>Stable Frame
The machine body is whole-casted, which makes high speed running stable and reliable.
>Flexible Cutting
Horizontal displacement worktable makes cutting flexible and efficient.
>High Efficiency
Set swing cutting function for diamond wire for high efficiency.
>Cut Large Size Materials
Suitable for cutting large size workpiece, the maximum cutting size is up to 800x800x800mm.
>Wire break memory system.
| Detail | Parameter |
| Model | DCX800 |
| Maximum work size | 800mm*800mm*800mm |
| Number of workbench | 1 |
| Storage | 40Km |
| Running Speed | Max1200m/min |
| Wire diamond | φ0.25mm~φ0.6mm |
| Cutting method | Diamond wire feeds parallel or swinging downwards |
| Workbench swing angle | ±30° |
| Cutting fluid | Water-based cutting fluid or cutting oil |
| Fluid storage | 130L |
| Fluid flow rate | 180L/min |
| Power | Three-phase 380V 50Hz |
| Full-load Power | 15kw |
| Air supply | 0.35Mpa-600L/min |
| Size L*W*H | 2510mm*2700mm*2500mm |
| Weight | 5000Kg |
1. What Materials Could The Multi-Wire Saws Cut?
Our multi-wire saws can cut all kinds of hard and brittle materials such as Sapphire, Quartz Crystal, Optical Glass, Magnets, Ceramics, Silicon Wafers, Silicon Carbide, Precious Metal, etc.
2. What's The Size Range Of The Cut Product?
The maximum diameter of the cut material is up to 1000mm.
The minimum thickness of the wafers after cutting is 0.1mm.
3. What's The Cut Accuracy Of Multi-Wire Saws?
±10μm. It's subject to the cut material, please consult us for actual data.
4. Can I Get A Sample?
We provide test cut service to you, free of charge. Please send your material and test requirements to us.
5. Which Countries The Equipments Have Been Exported To?
The USA, UK, Russia, Japan, Brazil, Korea, India, Singapore, Taiwan of CHINA.
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