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1 Piece (MOQ)
Tube Bevelling Machine
Shanghai Zhengzhuo Machinery Manufacturing Co., Ltd.
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ECU Rework Machine Heavy Wire Bonder/Battery Pack Aluminium Wire Bonding Machine
| Price | $8000.00 |
|---|---|
| Min Order | 1 Piece |
| Availability | In Stock |
| Shipping From | Guangdong, China |
| Popularity | 340 people viewed |
Type:
CNC
Control Mode:
CNC
Voltage:
AC220V
Trademark:
minder-hightech
Specification:
620*610*560mm
Origin:
Guangzhou
HS Code:
8015809090
Product Description
Product Description
Heavy wire bonder
Here we provide 7 types of most competitive wire bonder, 4 Types of manual wire bonder, and 3 types of automatic wire bonder.
The most competitive 4 types: thin aluminum wire wedge bonder MDB-2575(25-75um aluminum wire);Wire wedge bonder MDB-25125(25-125um aluminum wire); heavy aluminum wire wedge bonder MDB-7550(75-500um aluminum wire);gold wire ball bonder MDBB-1750(17-50um gold wire). they are very popular for small quantity production, school, institution, research department.
And the 3 automatic: automatic thin aluminum wire bonder MD-Etech1850(18-50um aluminum wire); automatic ball bonder MD-S800(15-50um Au or alloy wire); automatic heavy wire bonder MD-CWX-3710(125-500um Aluminum wire).
High power dynatron/FET/SCR, Power module, IGBT, High power Fast recovery diode, Schottky transistor, Lead attachment, wire bonding, TO-3,TO-3P,TO-3PF,TO-3PN,TO-3PL,TO-220F,TO-126,TO-12F,TO-66,TO-251,TO-202 etc.
Factory
Detail display
Heavy wire bonder
Here we provide 7 types of most competitive wire bonder, 4 Types of manual wire bonder, and 3 types of automatic wire bonder.
The most competitive 4 types: thin aluminum wire wedge bonder MDB-2575(25-75um aluminum wire);Wire wedge bonder MDB-25125(25-125um aluminum wire); heavy aluminum wire wedge bonder MDB-7550(75-500um aluminum wire);gold wire ball bonder MDBB-1750(17-50um gold wire). they are very popular for small quantity production, school, institution, research department.
And the 3 automatic: automatic thin aluminum wire bonder MD-Etech1850(18-50um aluminum wire); automatic ball bonder MD-S800(15-50um Au or alloy wire); automatic heavy wire bonder MD-CWX-3710(125-500um Aluminum wire).
High power dynatron/FET/SCR, Power module, IGBT, High power Fast recovery diode, Schottky transistor, Lead attachment, wire bonding, TO-3,TO-3P,TO-3PF,TO-3PN,TO-3PL,TO-220F,TO-126,TO-12F,TO-66,TO-251,TO-202 etc.
| electric requiement: | 220VAC±10%,50HZ,be sure connected to ground |
| aluminium wire diameter: | 75~500μm (3~20mil) |
| ultrasonic power: | 0-30W, two channel.can be set separately of the two point |
| bond time: | 10-500ms,two channel |
| bond force: | 30-1200g,two channel |
| motorized Y: | 0-18mm |
| microscope rate: | 7.5 and 15 |
| working area: | Φ25mm |
| light: | adjustable brightness |
| size: | 620×610×560mm |
| weight: | ~40kg |
Detail display
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