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ESD Moisture Barrier Bag for Wafer PCB Packing

Price $2.00
Min Order 3000 Pieces
Availability In Stock
Shipping From Jiangsu, China
Popularity 356 people viewed
Model NO.:
MBB001
Industrial Use:
Food, PCB, Wafer
Transparency:
Opaque
Layered:
Heat Seal
Hardness:
Soft
Basic Level:
Pet/Al/Ny/PE
Heat Seal:
LLDPE
Functional Layer:
AL
Packaging:
Bag
Bag Sealing Methods:
Flat Bag Packaging
Trademark:
Winet
Transport Package:
Carton and Pallet
Specification:
customized
Origin:
China
HS Code:
392321
Product Description
ESD Moisture Barrier Bag is widely used in vacuum packing of static sensitive electronic components, precise equipment, chemical raw material and medical intermediate etc.

Application:
ESD Moisture Barrier Bag is mainly applied to pack PCB, wafer, IC, large precise mechanical equipment, chemical raw material, medical intermediate, food and so on.

Features:
1. It is made of 3 or 4-layer laminated film. This film is featured of good moisture barrier and UV-light isolation property.
2. Different bag types are available as zip-lock bag, flat open bag, gusset bag, 3D large bag and round-bottom bag etc.
3. Film thickness and structure can be customized with enough MOQ.

Service and quality control  
1. We can support customers to print their logo or product introduction etc. with customers' authorization certificate.
2. Various thickness and special material structure can be customized.
3. The third-party testing reports are available such as ROHS and Halogen etc.

Material Structure:
Specification
 
Material CompositionPET/AL/NY/PE
Inner Surface ResistanceANSI ESD-STM-11.11  ≤ 1011 ohm
Outer Surface ResistanceANSI ESD-STM-11.11≤ 1011 ohm
Decay TimeIEC61340-5-1(±1000V~±100V)< 2s
Friction Voltage < 100V  
WVTR   ASTM F1249-2013< 0.0003g/100in2/24hs
OTR    ASTM D3985-2017< 0.01cc/100in2/24hs
 
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