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Engraving Marker Logo Fiber Laser Marking Machine

Price Negotiable
Min Order 1 Piece
Availability In Stock
Shipping From Jiangsu, China
Popularity 347 people viewed
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After-sales Service:
Provided
Warranty:
12 Months
Laser Visibility:
Visible
Applicable Material:
Metal
Laser Wavelength:
Fiber Laser
Laser Classification:
Semiconductor Laser
Product Name:
Flying Marking Machine
Feature 1:
High Efficiency
Feature 2:
High Precision
After-Sale Service:
Provided
Trademark:
Himalaya
Transport Package:
Customized or Wooden Box Packaging
Specification:
Standard Specifications
Origin:
China
Product Description
Engraving Marker Logo Fiber Laser Marking Machine
Product Description
Brief Description
Fiber Laser mainly applicable to metal materials, partial plastic materials and coated non-metal materials by high-speed flight marking. Such as aluminum,stainless steel,copper etc., and few plastic material, metal can with coating layer, color printing paper etc.
 
Main Parameter
ItemParameter
Wavelength1064nm
Power20W
Stability≤5%
Single Pulse Energy1mJ
Working Frequency20-200KHz
Minimum Code Width0.1mm
Minimum Character Size0.30mm
Repeatability Accuracy±0.01mm
Standard Marking Range100mm×100mm
Standard Focal Length188±2mm(From laserhead baseboard to focus area)
Optional Marking Range70mm×70mm to 400mm×400 mm
Nominal Line Speed≥10000mm/s
Printing Code>700 Chars/Sec
Power RequirementAC 220V/50HZ/3A
Overall Power ConsumptionPeak≤0.5KW,Average≤0.25KW
Cooling Mode Air Cooling
Level of ProtectionIP54
Cable Length3m
Machine Sizemain beam:578mm×96.5mm×124mm
main control cabinet:515mm×220mm×456mm
lifting platform:450mm×450mm×1100mm(Customized)
 
Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:Why choose us?
A3:OEM/ODM/Designing service.

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