Menu
Suppliers Products
Global B2B sourcing platform
Verified suppliers and manufacturers
MadeInChina.com > Manufacturing & Processing Machinery > Laser Equipment > Laser Marking Machine
Swipe or use the arrows to view product images.

Gears / Shafts / Bearings / Clutch / Metal Fiber Laser Marking Machine

Price Negotiable
Min Order 1 Piece
Availability In Stock
Shipping From Jiangsu, China
Popularity 529 people viewed
Send Inquiry View Full Page
Model NO.:
YLP-H20
After-sales Service:
Provided
Warranty:
12 Months
Applicable Material:
Metal
Laser Wavelength:
Fiber Laser
Laser Classification:
Semiconductor Laser
Product Name:
Fiber Laser Marking
Feature 1:
High Precision
Feature 2:
High Efficiency
After-Sale Service:
Provided
Trademark:
Himalaya
Transport Package:
Customized or Wooden Box Packaging
Specification:
Standard Specifications
Origin:
China
Product Description
Gears / Shafts / Bearings / Clutch / Metal Fiber Laser Marking Machine
Product Description
Brief Description
1. Various metal materials, part of non-metal materials.
2. The fiber optic laser oscillator marker has advantage of high beam quality and high reliability. It is suitable for processing fields that need high marking depth, smoothness and accuracy.
Features:
1. Laser marking machine on promotion, high cost performance.
2. Fiber lasergenerator ,low consumption, easy for maintain.
3. Compact design, 760mm×610mm×1494mm.
4. Optional lens for different marking area.
Specification:
1Laser Wavelength1064nm
2Laser Power20W
3Repeating Frequency10-200KHz
4Marking Field100mm×100mm(F160)
5Marking Line Width≥0.05mm
6Marking Window Upgrade160mm x 160mm (F254 Lens)
290mm x 290mm (F420 Lens)
7Min. Character Size0.3mm
8Marking Speed≤7000mm/s
9Repeat Accuracy±0.003mm
10Cooling systemAir cooling
11System WeightAround 155KG
12Power Supply220V/Single Phase/50Hz/60Hz/5A
13Power Consumption of Complete Machine500W
14Overall Dimension760mm×610mm×1494mm
 
Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:Why choose us?
A3:OEM/ODM/Designing service.

  • Similar Products
Full Page Contact Supplier
↑