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High End Laser Dicing Processing Ceramic Equipment
| Price | Negotiable |
|---|---|
| Min Order | 1 Piece |
| Availability | In Stock |
| Shipping From | Jiangsu, China |
| Popularity | 363 people viewed |
Model NO.:
Himalaya-6688-8
After-sales Service:
Provided
Function:
Laser Cutting
Demoulding:
No
Condition:
New
Certification:
RoHS, ISO, CE
Warranty:
12 Months
Automatic Grade:
Automatic
Installation:
Desktop
Driven Type:
Electric
Mould Life:
Laser Warranty for One Year
Product Name:
High End Laser Dicing Processing Ceramic Equipmen
Feature 1:
High Precision
Feature 2:
High Efficiency
Trademark:
Himalaya
Transport Package:
Customized or Wooden Box Packaging
Specification:
1400 x2400x 2440 (including tricolor light)
Origin:
China
Product Description
High End Laser Dicing Processing Ceramic Equipment
Ceramic sheet: Used for making ceramic substrate, plate splitting and cutting, etcIt mainly includes alumina, aluminum nitride and other materials Performance: >Applicable product thickness range : 0.1mm- 3.0mm >Scribing speed :40- 150mm/s , It is related to film thickness >Spot size :40- 100μm >Compatible dimensions : 110mm × 110mm ~ 300mm × 300mm >Machining accuracy : ±10μm >he depth of the line can be adjusted, and the depth consistency is : ± 20um >Minimum line width 50um (varying with depth)
explain: The following contents are general requirements, and the details will be adjusted according to the needs of customers
Technical recommendation of 2 station ceramic laser dicing machine
Ceramic sheet: Used for making ceramic substrate, plate splitting and cutting, etcIt mainly includes alumina, aluminum nitride and other materials Performance: >Applicable product thickness range : 0.1mm- 3.0mm >Scribing speed :40- 150mm/s , It is related to film thickness >Spot size :40- 100μm >Compatible dimensions : 110mm × 110mm ~ 300mm × 300mm >Machining accuracy : ±10μm >he depth of the line can be adjusted, and the depth consistency is : ± 20um >Minimum line width 50um (varying with depth)
technical requiremen |
Is it an integral table |
/ |
Integral table |
Substrate size |
MAX:160*300mm |
110mm × 110mm~300mm × 300mm | |
Automatic processing substrate size |
≥197*150 |
110*110mm-300*300mm | |
thickness |
0.25-1.5mm |
0.1-3mm | |
Dimensional deviation - single head |
±0.01mm |
±0.01mm | |
Dimensional deviation - Comparison of two ends |
±0.03mm |
±0.03mm | |
Depth deviation - single head |
±0.02mm |
±0.02mm | |
Depth deviation - Comparison between two ends |
±0.04mm |
±0.04mm | |
line width |
≤0.1mm |
≤0.1mm | |
Scribing speed |
40-150mm/s |
40-150mm/s | |
Axis positioning accuracy |
±2.5um |
±2.5um | |
Axis repeat positioning accuracy |
±2um |
±2um | |
Spot size |
40-100μm |
40-100μm | |
Alignment mode of initial point in ceramic wafer processing |
CCD positioning |
CCD positioning | |
Laser type, brand |
Quasi continuous IPG, fully imported |
Quasi continuous IPG, fully imported |
Serial number |
name |
Model and specification |
Quantity (set) |
Original manufacturer and origin |
1 |
Three axis gantry platform(X\Y\Z) |
250*900*50mm |
1 |
H |
2 |
guide |
N2535500 |
4 |
Akribis/Import |
3 |
Linear motor |
/ |
2 |
Import |
4 |
Grating and reading head |
RGH24 |
2 |
Renishaw/Import |
5 |
Fiber laser |
YLM-150/1500-QCW-AC-Y11 |
2 |
IPG/Import |
6 |
IPC |
Han ,s customization |
1 |
Advantech/china |
7 |
Cutting head |
FM220-100 |
2 |
RayTools/Import |
8 |
Transfer assembly |
Han ,s customization |
2 |
H |
9 |
softw |
Han family precision micromachining software |
1 |
H |
10 |
monito |
1715S |
1 |
DELL/Import |
11 |
Motion control system |
CMba2C04NA00WNNNYN ACS |
1 |
ACS/Import |
12 |
PLC |
6ES7 288-1ST0-0AA0 |
2 |
SIEMENS/Import |
13 |
Frame and housing |
Han ,s customization |
1 |
H |
14 |
Fixture |
Han ,s customization |
1 |
H |
15 |
Loading and unloading table |
Han ,s customization |
2 |
H |
16 |
Dust collector |
/ |
1 |
H |
17 |
Pneumatic components |
/ |
/ |
CHELIC,SMC/Import |
name |
parameter |
remarks |
Overall dimension (w * L * h) |
3450mx 2300mmx 2000mm |
For reference only |
Floor size |
3500mmx 3000mmx 2000mm |
For reference only |
weight |
≈3.5ton |
|
ambient temperature |
20~25ºC |
The temperature fluctuation is less than ± 2 ºC |
ambient humidity |
40%~60% |
No condensation |
Power Supply |
AC 220/380V ±5% /50Hz/63A |
The grounding is good, and the grounding resistance is less than 4 ohms |
Power |
10KW |
Theoretical peak power |
compressed air |
0.6~0.8MPa |
3 quick plug connectors (with φ 8mm (gas tube) |
Dust extraction |
φ100mm |
Connect with the customer's Central purification system |
Vibration source |
VC-B |
Avoid installing near the punch and other sources |
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choose us?
A3:OEM/ODM/Designing service.
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