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High-End Thermal Pad Management Solution for Phase Change Material, Tpcm 785
| Price | $5.00 |
|---|---|
| Min Order | 1000 Pieces |
| Availability | In Stock |
| Shipping From | Guangdong, China |
| Popularity | 495 people viewed |
Model NO.:
TPCM 785
Certification:
RoHS, ISO9001
Type:
Thermal Pad
Material:
Phase Change Material
Form:
Sheet
Shape:
Rectangular or Heteromorphic
Color:
Grey
Thickness:
0.13mm
Bulk Thermal Conductivity:
5.4
Operating Temperature Range:
-40 to 125°c
Softening Temperature Range:
≈45°c to 70°c
Minimum Bondline Thickness:
25µm
Dielectric Constant:
22.3@1kHz, 22.9@1MHz
Volume Resistivity:
1.5X10^13 Ω-Cm
Trademark:
Laird
Transport Package:
Land and Air; Carton, 200 Per Pack
Specification:
Private message communication
Origin:
USA
Product Description
TPCM 785 is a high-performance, thin bondline Thermal Interface Material meticulously designed to meet the high thermal conductivity and low thermal resistance requirements of today's demanding processors. This advanced solution effectively reduces contact thermal resistance by effortlessly filling the microscopic irregularities of the contacted components. Specially crafted to meet the stringent thermal conductivity and low thermal resistance requirements of Intel mobile processors, the TPCM 780 series features an innovative material composition. This unique formulation softens and flows at around 45ºC, thereby minimizing migration (pump out) by filling the microscopic irregularities of the surrounding components. TPCM 780's reliability has been demonstrated through 2000 hours of various aging tests, resulting in proven dependability at an operating temperature of 125°C.
Features and benefits:
• Silicone-free gap filler for versatile applications
• Naturally tacky at room temperature, requiring no adhesive.
• Naturally tacky for adhesion during assembly and transport
• Fully characterized long term reliability
• Heat sink preheating not required
• No pump out
• Easy rework at room temperature
• Naturally tacky at room temperature, requiring no adhesive.
• Naturally tacky for adhesion during assembly and transport
• Fully characterized long term reliability
• Heat sink preheating not required
• No pump out
• Easy rework at room temperature
Dongguan City U.ONE Electronic Technology Co., Ltd. was officially established in 2009. It is a professional enterprise in China that integrates research and development, agency, processing, production, and sales of thermal conductivity, conductivity, and insulation products. The company has a production and research base of approximately 3000 square meters, located at No. 20 Nonglin Road, Long bei Ling Village, Tangxia town, Dongguan city, Guangdong province, China. Adhering to the business philosophy of "service first, quality first, and reasonable prices", the company has established long-term cooperative relationships with multiple enterprises across the country.
Mainly product: thermal pad, thermal grease,phase change material ,mylar ,silicone rubber sheet, foam, ,silicone products,etc. Products can provide customized services, including customized sizes, customized label,customized packaging, for customers to choose.
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