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High Precision Automatic Dicing Saw Machine for Silicon Wafers, GaAs, GaN, Glass, Sic, PCB Board
| Price | $500000.00 |
|---|---|
| Min Order | 1 Set |
| Availability | In Stock |
| Shipping From | Jiangsu, China |
| Popularity | 267 people viewed |
Function:
High Temperature Resistance
Demoulding:
Automatic
Condition:
New
Certification:
ISO
Warranty:
12 Months
Automatic Grade:
Automatic
Installation:
Desktop
Driven Type:
Electric
Mould Life:
>1,000,000 Shots
Product Name:
Semiconductor Wafer Saw Machine
Feature 1:
Guaranteed Quality
Feature 2:
Customized According to Needs
OEM/ODM Service:
Provided
Trademark:
Himalaya
Transport Package:
Customized or Wooden Box Packaging
Specification:
Standard Specifications
Origin:
China
Product Description
It can be widely used in Silicon wafers, GaAs, GaN, Glass, Sic, PCB board , QFN, DFN, Pottery and porcelain etc.
| X axis | maximum effective input rang of feed speed | 310mm 0.1-1000mm/s | 310mm | 210mm |
| 0.1-1000mm/s | 0.1-600mm/s | |||
| Y axis | max effective | 310mm | 310mm | 170mm |
| single step increment | 0.0001mm | 0.0001mm | 0.0001mm | |
| reach accuracy | 0.003mm/310mm | 0.003mm/310mm | 0.003mm/170mm | |
| Z axis | maximum effective | 40mm | 40mm | 40mm |
| repetition accuracy | 0.001mm | 0.001mm | 0.001mm | |
| maximum cutter diameter | 58 | 58 | 58 | |
| T axis | maximum rotation angle | 380° | 380° | 380° |
| spindle | speed range | 6000-60000rpm | 6000-60000rpm | 6000-60000rpm |
| output power | 1.8KW(2.4KW) | 1.8KW(2.4KW) | 1.5KW (2.4KW) | |
| power | AC380V±10% | AC380V±10% | AC380V±10% | |
| Size W×D×H | 1200mm×1629mm×1849mm | 1080mm×1160mm×1800mm | 630mmx900mmx1600mm | |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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