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High Precision Eutectic Wafer Bonder Chip Bonding Equipment with Die Attach System

Price $1000000.00
Min Order 1 Piece
Availability In Stock
Shipping From Jiangsu, China
Popularity 325 people viewed
Model NO.:
SHD8060
After-sales Service:
Provided
Condition:
New
Speed:
High Speed
Precision:
High Precision
Certification:
ISO
Warranty:
12 Months
Automatic Grade:
Automatic
Product Name:
Semiconductor Equipment
Feature 1:
Guaranteed Quality
Feature 2:
Customized According to Needs
After-Sale Service:
Provided
Trademark:
Himalaya
Transport Package:
Customized or Wooden Box Packaging
Specification:
Standard Specifications
Origin:
China
Product Description
 
Product Description

Equipment Specifications
  DIE BONDERSHD8060
  Bonding methodEutectic
  Bonding precisionX/Y ±0.04mm
  Bonding speed (UPH)20K(Chip size 0.3mmX0.3mm,SOT23-13R frame)
  Chip size0.2mmx0.2mm~2.3mmx2.3mm
  Wafer size3~8 inches (with 8-inch work frame)
  Frame typeSilver-plated frame,bare copper frame,nickel-plated frame(up to 65mm wide)
  Frame movementRoller feeding (Tape reel frame)
  Chip rotation angle ±3°
  Wafer movementMechanical advancement
  Top chip angle 0°to  360°
  Bonding headVacuum surface suction
  Bonding arm 180°
  Bonding strength20~200g
  Adaptable nozzleSteel nozzle,rubber nozzle,bakelite nozzle
  Image recognition256-level grayscale
  Resolution640×480 pixels
  Recognition accuracy0.025mil~50mil observation range
  Dimensions(mm1900*1240*1350
  Equipment weight (kg)About 600kg
Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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