High Precision Eutectic Wafer Bonder Chip Bonding Equipment with Die Attach System
| Price | $1000000.00 |
|---|---|
| Min Order | 1 Piece |
| Availability | In Stock |
| Shipping From | Jiangsu, China |
| Popularity | 325 people viewed |
| Equipment Specifications | |
| DIE BONDER | SHD8060 |
| Bonding method | Eutectic |
| Bonding precision | X/Y ±0.04mm |
| Bonding speed (UPH) | 20K(Chip size 0.3mmX0.3mm,SOT23-13R frame) |
| Chip size | 0.2mmx0.2mm~2.3mmx2.3mm |
| Wafer size | 3~8 inches (with 8-inch work frame) |
| Frame type | Silver-plated frame,bare copper frame,nickel-plated frame(up to 65mm wide) |
| Frame movement | Roller feeding (Tape reel frame) |
| Chip rotation angle | ±3° |
| Wafer movement | Mechanical advancement |
| Top chip angle | 0°to 360° |
| Bonding head | Vacuum surface suction |
| Bonding arm | 180° |
| Bonding strength | 20~200g |
| Adaptable nozzle | Steel nozzle,rubber nozzle,bakelite nozzle |
| Image recognition | 256-level grayscale |
| Resolution | 640×480 pixels |
| Recognition accuracy | 0.025mil~50mil observation range |
| Dimensions(mm | 1900*1240*1350 |
| Equipment weight (kg) | About 600kg |
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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