Menu
Global B2B sourcing platform
Verified suppliers and manufacturers

High Precision Wafer Thinning Machine Grinding Equipment Manufacturers Industrial Automation Device

Price Negotiable
Min Order 1 Piece
Availability In Stock
Shipping From Jiangsu, China
Popularity 525 people viewed
Model NO.:
WTGM-300
After-sales Service:
Online Service
Warranty:
1 Year
Application:
Automotive Industry
Technical Class:
Continuous Wave Laser
Control:
Automatic
Laser Classification:
Semiconductor Laser
Type:
Silicon Steel Sheet Laser Welding Machine
Trademark:
Himalaya
Transport Package:
Air Freight
Origin:
China
Product Description
High Precision Wafer Thinning Machine Grinding Equipment Manufacturers industrial Automation device
 
Product Description


High precision grinding machine equipment principle:
1. This series of transverse thinning grinding machine is a fully automatic precision grinding equipment. The workpiece is rotated in the opposite direction by the vacuum suction cup or electromagnetic suction cup, and the grinding wheel swings back and forth. The grinding resistance is small, the workpiece will not be damaged, and the grinding efficiency is high.
2. The equipment can automatically set the tool, actually detect the grinding torque, and automatically adjust the workpiece grinding speed, so as to prevent the workpiece from deformation and damage due to excessive pressure in the grinding process, and automatically compensate the grinding wheel wear thickness.

APPLICATION
Single
Plate
Lapping
& Polishing
Metal And Alloy
Ceramic
Oxide
Carbide
Glass
Plastic
Nature Stone
Sealingvalve and sealing ring(liquid, oil, gas)
SemiconductorLED substrate(Al2O3, Si, SiC)
wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN)
PlasticPE, E/VAC, SBS, SBR, NBR, SR, BR, PR
Phone Frame(flat)back plate
PCBadhesive, coating, circuit
Optics(flat)optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass
Radaroxide coating plate
Gemstonejade, sapphire, agate, etc.
Othersgraphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware.
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning (≤100μm), thinner machine are needed.
Detailed Photos

 

Exhibition & Customers

Field Application

 

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 
  • Similar Products
Full Page Contact Supplier