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Higher Accuracy Wire Bonding/Welding Machine for to, Sot, Sop, Ssop, Tssop, Solc, Qfp, DIP, BGA, COB
| Price | $170000.00 |
|---|---|
| Min Order | 1 Box |
| Availability | In Stock |
| Shipping From | Jiangsu, China |
| Popularity | 493 people viewed |
After-sales Service:
We Have
Demoulding:
Pull Core
Condition:
New
Certification:
CCC, PSE, FDA, RoHS, ISO, CE
Warranty:
12 Months
Automatic Grade:
Automatic
Installation:
Vertical
Driven Type:
Pneumatic
Mould Life:
>1,000,000 Shots
Online Technical Guidance:
Once Every Month
Visit The Production and Use of Customer:
2-4 Times/Year
Invite Customer Technical Personnel to S:
2 Opportunities Per Year
Introduction of Domestic Advanced Techno:
Every Year, We Will Share The Technical Updates of
Trademark:
Himalaya
Transport Package:
International Trade Standard
Specification:
985mm*960mm*1770mm
Origin:
China
HS Code:
8486402200
Product Description
High Speed Fully Automatic Gold/Copper Wire Bonder
1,New servo system, faster response, higher accuracy, and higher UPH;
2,New zoom lens, wider range, clearer images, and higher structural stiffness;
3,New defense line module to improve consistency in wiring;
4,More stable binding force control, more precise force response;
5,Advanced bonding force calibration capability, fast and accurate, and easy to operate;
6,Intelligent detection function, prompting users to perform timely calibration of bonding force;
7,High precision post weld inspection function (PBI);
8,New line arc algorithm, suitable for more materials and meeting the needs of complex products;
9,The operation control drive system, optical system, and core components with independent intellectual property represent the leading level of the industry;
10,Applicable to IC products:TO, SOT, SOP, SSOP, TSSOP, SOLC, QFP, DIP, BGA, COB, optocoupler, etc
11,Soldering cycle: 45ms/line;
12,XY table:
Driving method:Linear motor drive;
Drive:Linear motor drive;
Maximum welding line area:X:56mm,Y:80mm;
Max bonding area:X:56mm,Y:80mm;
repeatability:±3μm@3sigma;
Position accuracy:±3μm@3sigma;
13,Bonding parameters:
Applicable wire diameter:Φ15~ Φ50μm;
Wire diameter:Φ15~ Φ50μm;
Soldering cycle:45ms/line;
Bonding cycle:45ms/wire;
14,Material handling system:
Material inlet and outlet structure:Vertical Stacked;
Material handling:mechanism;
Equipment material box:2-3;
No of buffered magazine:2-3;
15,Applicable magazine:
Length:100~275mm;
Width:30~90mm;
Height:65~180mm;
Magazine Pitch:1.5~10mm;
16,Size(Width*Depth*Height):
Weight:≈660Kg;
Size(Width*Depth*Height):985mm*960mm*1770mm;
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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