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Laser Cutting Machine for PCB Printed Circuit Board Flex PCB Laser Cutting

Price Negotiable
Min Order 1 Piece
Availability In Stock
Shipping From Jiangsu, China
Popularity 496 people viewed
Send Inquiry View Full Page
After-sales Service:
Provided
Condition:
New
Certification:
RoHS, ISO, CE
Warranty:
Provided
Automatic Grade:
Manual
Installation:
Vertical
Driven Type:
Pneumatic
Product Name:
Automatic Laser Cutting
Feature 1:
High Precision
Feature 2:
High Efficiency
After-Sale Service:
Provided
Trademark:
Himalaya
Transport Package:
Customized or Wooden Box Packaging
Specification:
Standard Specifications
Origin:
China
Product Description
 Laser Cutting Machine for PCB Printed Circuit Board Flex PCB Laser Cutting
Product Description
Product Features

  • Select laser, fixture and stage according to actual product processing needs

  • One machine for drilling, cutting and scribing, reducing customer costs

  • Support full cutting / half cutting process

  • Single and double head, online, offline, automatic loading and unloading options, strong flexibility

  • Support multi-feature CCD visual positioning, with automatic compensation function

Application
PCB/FPC/RF/Touch ID/Type-C/TF-Card
/LGA/BGA and other ty pes of modules,
circuit boards, packaging IC carrier
board precision cutting, slotting
 
Technical specification 
Laser wavelength355nm, 532nm, 1064nm, etc.
Laser pulse widthNanosecond, picosecond, femtosecond
Laser powerUV30W Max, Green60W Max
Laser Life>20,000 hours
Product thickness≤2mm
Cutting Range350×400mm, can be customized
Processing speed800mm/s(Max.)
Platform AccuracyRepeat ≤1μm, positioning ≤3μm
Positioning accuracy±5μm
 
Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:Why choose us?
A3:OEM/ODM/Designing service.

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