Lead Fream Disc Selective Silver Plating Equipment

 
      Integrated Circuit Lead Fream disc selective silver plating equipment
       
        Speed: 3-12m/min
        Channel: 2 
        Accuracy:  ±0.075mm
        The way of unlaod and offload: Roll to Roll
        Control way: Φ254-480mm Disc Die × 2SETS
        Applicable product width: 10-110mm;    thickness:  0.08-1.02mm

        In view of the current multi-row and high-density lead frames, a comprehensive technical upgrade has been carried out in order to solve the problem as traditional production line has low good product rat and poor thickness unitormity.

FAQ
Q:Are you manufacturer or trading company ?
A:We are a professional manufacturer of large-scale research and production of semiconductor wet process equipment. We have a professional research and development team and production and assembly workshop, which can ensure quality and after-sales service.

Q:What is the width of the equipment ?
A:The width of the equipment is about two meters.

Q:How long is the warranty ?
A:The warranty period of our equipment is one year. One-step service, professional engineers to follow up to solve the problem.