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Molybdenum Cooper Alloy Mo75cu25 Sheet Plate

Price $50.00
Min Order 1 kg
Availability In Stock
Shipping From Henan, China
Popularity 497 people viewed
Model NO.:
Mo alloy
Application:
Aviation, Electronics, Industrial, Medical, Chemical
Standard:
GB, ASTM
Purity:
as Required
Alloy:
Alloy
Type:
Molybdenum Plate
Powder:
Not Powder
Surface:
Ground Polished
Delivery Time:
10-15 Days
Certificate:
ISO9001:2000
Size:
as Required
Advantage:
Professional
Trademark:
tongchang
Transport Package:
Paper Boxes Wooden Case
Specification:
as required
Origin:
China
HS Code:
8102990000
Product Description
MoCu alloy is a kind of pseudo-alloy that is composed of molybdenum and copper. It consists of both the characteristics of molybdenum and copper, having high thermal conductivity, low adjusted thermal expansion coefficient, Beijing non-magnetic, low content of gas, good vacuum resistance, good machinability and special high-temperature performance, etc.

Compared with WCu alloy, MoCu alloy has lower density and is easier to stamp, It makes MoCu suitable for valume produce.
Product Brief Introduction:
Mo-Cu composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.

Surface: Plating Ni, NiAu, NiAg, or Non-plating
Product Properties:
Physical Properties of Major Products
MaterialWt%
Molybdenum Content
Wt%
Copper Content
g/cm3
Density at 20ºC
Thermal conductivity at 25ºCCoefficient of thermal
expansion at 20ºC
Mo85Cu1585± 1Balance10160 - 1806.8
Mo80Cu2080 ± 1Balance9.9170 - 1907.7
Mo70Cu3070 ± 1Balance9.8180 - 2009.1
Mo60Cu4060 ± 1Balance9.66210 - 25010.3
Mo50Cu5050 ±0.2Balance9.54230 - 27011.5
Applications:
These composite are widely used in applications, such as, optoelectronics packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.

Product Brief Introduction:
Cu/Mo/Cu(CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high thermal conductivity and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.

The features of copper molybdenum copper
 Large sized sheets available (length up to XXmm, width up to XXXmm)
Can be stamped into components
Strong interface bonding resist to 850ºC heat shock repeatedly
Tailorable CTE matching that of semiconductor and ceramics
High thermal conductivity
Product Properties:
MaterialsDensity at 20ºCCoefficient of thermal expansion at 20ºCThermal conductivity at 25 ºC
In - planethru - thickness
13:74:139.885.6200170
1:4:19.756.0220180
1:3:19.666.8244190
1:2:19.547.8260210
1:1:19.328.8305250
Applications:
Applications are similar with W-Cu composites.
Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages, GaAs device mounts.
 
Product Brief Introduction:
Cu/Mo70Cu/Cu(CPC) is a sandwich composite similar to that of Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu: Mo-Cu: Cu is 1:4:1. It has different CTE in X and γ direction, with higher thermal conductivity than that of W (Mo)-Cu & Cu/Mo/Cu and less expensive. All types of Cu/Mo70Cu/Cu sheets can be stamped into components,.

Features of Cu/Mo70Cu/Cu
 Large sized sheets available (length up to XXmm, width up to XXmm)
More easily to be stamped into components than CMC
Very strong interface bonding which can repeatedly resist 850ºC heat shock
Higher thermal conductivity and lower cost
Product Properties:
MaterialsDensity at 20ºCCoefficient of thermal expansion at 20ºCThermal conductivity at 25 ºC
In - planethru - thicknessIn - planethru - thickness
1:4:19.47.29.0340300




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