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Mustar High Quality Custom Electronic Board Assembly PCBA Manufacturer in China

Price $1.00
Min Order 10 Pieces
Availability In Stock
Shipping From Guangdong, China
Popularity 329 people viewed
Metal Coating:
Copper
Mode of Production:
SMT
Layers:
Multilayer
Base Material:
FR-4
Certification:
RoHS, CCC, ISO
Customized:
Customized
Condition:
New
Shape:
DIP
Conductive Type:
Bipolar Integrated Circuit
Integration:
Gsi
Technics:
Semiconductor IC
D/C:
Standard
Warranty:
2 Years
Mounting Type:
Standard, SMT, DIP
Cross Reference:
Standard
Memory Type:
Standard
Trademark:
Mustar
Transport Package:
Carton
Specification:
unlimited
Origin:
Shenzhen
Product Description


Welcome to Mu Star (Shenzhen) Industry Co., LTD
Our Advantages
1. Program and functional test and package by Free.
2. High quality: IPC-A-610E standard, E-test, X-ray, AOI test, QC, 100% functional test.
3. Professional service: PCB Layout, PCB/FPC/Aluminium Making, SMT, DIP, Component Sourcing, PCB Assembly, Housing and assembly,
Box Building, OEM Service.
4. Certifications: 94v-0, CE, SGS, FCC, RoHS, ISO9001, ISO14001, ISO13485, TS16949
5. The warranty period for PCBA: 2 years.
6. About Factory: 16 SMT Lines, 4 DIP Lines, 1 X-Ray, 32 AOI, 2 Sample test machines.


Specification
1
Material
FR4, (High Tg FR4, General Tg FR4, Middle Tg FR4), Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, PI Material, BT Material, PPO, PPE etc.
2
Board thickness
Mass production: 394mil(10mm) Samples: 17.5mm
3
Surface finish
HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
4
PCB Max panel size
1150mm × 560mm
5
Layer
Mass production: 2~58 layers / Pilot run: 64 layers, Flexible PCB: 1-12 Layers
6
Min hole size
Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
7
PCBA QC
X-Ray, AOI Test, Functional Test
8
Special Process
Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.
9
Our service
PCB, Turnkey PCBA, PCB Clone, Housing, PCB Assembly, Component sourcing, PCB manufacturing from 1 to 64 layers
10
Sanforized
Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back drill, impedance control.
11
SMT Capacity
700 Million Points/Day
12
DIP Capacity
5 Million Points/Day
13
Certificate
CE/RoHS/ISO9001/ISO14001/ISO13485/TS16949


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