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Performance High Efficiency PCB/FPC/RF/Touchid/Type-C/TF-Card/LGA/BGA Module Laser Cutting Machine

Price $1000000.00
Min Order 1 Piece
Availability In Stock
Shipping From Jiangsu, China
Popularity 372 people viewed
Send Inquiry View Full Page
After-sales Service:
Provided
Condition:
New
Warranty:
Provided
Automatic Grade:
Manual
Installation:
Vertical
Driven Type:
Pneumatic
Product Name:
PCB Module Laser Cutting
Feature 1:
Guaranteed Quality
Feature 2:
Customized According to Needs
After-Sale Service:
Provided
Trademark:
Himalaya
Transport Package:
Customized or Wooden Box Packaging
Specification:
Standard Specifications
Origin:
China
Product Description
 
Product Description
Product Features

  • Staggered cutting with double stations for high efficiency

  • Adopt telecentric lens, good cutting verticality

  • Off-axis CCD automatic positioning system, high cutting accuracy

  • Complete full monitoring and feedback capability

  • Automatic loading and unloading, high-speed placement, defect detection, etc.

 
Application
PCB/FPC/RF/TouchID/Type-C/
TF-Card/LGA/BGA and other
types of modules, circuit boards,
packaging IC carrier board
precision cutting and post-cutting
inspection, scheduling, etc
Technical specification 
Laser TypeUVGreen
Laser Power15W/20W/30W
35W/40W/60W		15W/20W/30W
35W/40W/60W
Cutting Range300×200mm(customizable)
Cutting Accuracy±30μm
Cutting Accuracy±0.1mm
Max. cutting thickness≤2mm
Min. cutting line width<20μm
 
Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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