Plastic Encapsulated Integrated Circuit Lead Frame Tining Equipment Series

       High-density plastic encapsulated integrated circuit lead frame tining equipment series

       Speed: 3-12m/min
       Specifications: 1-2 channels
       Cladding:  CPK≥1.67
       The way of unlaod and offload: Strip to Strip   By the steel belt toclamp
       Applicable product width: 20-110mm;    thickness:  1-12mm

      Our equipment can achieve the integrated automatic production of electrolytic softening, high-pressure water jet, high-speed tin plating and blanking, through the feeding system,plastic-packaged ic lead frame  is continuously clamped and fixed on the continuously running transmission steel belt.

FAQ
Q:Are you manufacturer or trading company ?
A:We are a professional manufacturer of large-scale research and production of semiconductor wet process equipment. We have a professional research and development team and production and assembly workshop, which can ensure quality and after-sales service.

Q:What is the width of the equipment ?
A:The width of the equipment is about two meters.

Q:How long is the warranty ?
A:The warranty period of our equipment is one year. One-step service, professional engineers to follow up to solve the problem.