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Power Devices Heatsink Insulation Pad for MOS Transistor IGBT Transistor

Price $0.30
Min Order 100 Pieces
Availability In Stock
Shipping From Guangdong, China
Popularity 325 people viewed
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Model NO.:
Standard
Application:
Thermal Insulation, Electrical Insulation
Shape:
Customized
Strength:
High Strength
Thermal Rating:
250 250
Application:
Insulators, Electrical Base, Shell
Material:
Ceramic
Maximum Voltage:
10kv~20kv
Color:
White, Gray
Product Name:
Alumina Ceramic Thermal Pad
Grade of Material:
95% Alumina or Aluminum Nitride
Feature:
High Insulation, High Mechanical Strength
About Pictures:
for Reference Only
About The Quotation:
Please Contact Us for a Quote Based on Actual Prod
Type:
Solid
Chemistry:
Inorganic Insulation
Classification:
Inorganic Insulation Material
Certification:
ISO9001
Trademark:
JingHui
Transport Package:
Individual Packaging
Specification:
Max. 800mm mmx 1000mm x 30mm
Origin:
China
HS Code:
8547100000
Product Description
Power Devices Heatsink Insulation Pad for MOS Transistor IGBT Transistor
 

Product Description

Ceramic pad for Mosfet TO packaging is made of 95% alumina (al2o3) which is an engineered ceramic.  It offers high thermal conducitivity up to 24 W/m.K. Therefore, the ceramic pad could quickly transfer the heat of IC generated to outside and ensure the chips reliability. 


The visual quality of alumina ceramic pad is vital at assemble process, Thus, deburr and polishing process will be manipulated before shipping, and then ensure the surface smooth free of any burrs. 


Besides, alumina ceramic pad in the application could offer other strengths, such as wonderful electrical insulation  high mechanical strength and corrosion resistance. The ceramic pad could significantly prolong the TO packaging service lifespan.

 

The specification

We have been producing various of standard alumina ceramic pads for MOS TO packaging, refer to the following table in detail:
 

S/NFigureTypeSize
1
 
 
For TO-22020mm *14mm * 1mm with φ5mm hole
2For TO-22018.5mm * 12mm * 1mm with φ3.8mm hole
3For TO-24722mm * 17mm * 1mm with φ3.7mm hole
4For TO-26428mm * 22mm * 1mm with 3.4mm hole
5For TO-3P25mm * 20mm * 1mm with φ4mm hole

Remark:   0.6mm thick alumina ceramic pads are standard parts.
 

Typical Applications


These alumina ceramic pads are widely used in MOS/IC/triode, diode & IGBT,  high frequency communication devices, high density switching power supply, and high frenquency welding machines, and so on. 

Why choose us?

We have integrated production lines from raw material formulating, shaping, sintering and secondary process at house, hence, we could control the consistency of quality and manufacturing cost well. 

Certifications

Our Partners


If you are looking for ceramic pads for your Mosfet TO package,  please feel free to call us or email to us. We'll be there anytime.
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