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Semi-Auto Molding System Machine Injection
| Price | $65000.00 |
|---|---|
| Min Order | 1 Piece |
| Availability | In Stock |
| Shipping From | Guangdong, China |
| Popularity | 418 people viewed |
After-sales Service:
1 Years Except Worn Parts
Warranty:
1 Year
Molding Material:
Epoxy Molding Compound
Automatic Type:
Semi-Auto
Temperature Control:
8 Phase Control
Mold Clamping Pressure:
98-1176kN
Injection Pressure:
1-29.4kN, 8-Stage Injection Speed Adjustable
Applicable Lead Frame/Substrate Size:
Width 20-90mm, Length 124- 300mm, Thickness 0.15-
Applicable Plastic Sealing Material Spec:
Φ11-Φ20mm(±0.2mm), Length < 35mm
Control System: PLC (Omron):
Pressure Curve Output and Storage
Acquisition System:
Pressure Curve Output and Storage
Loading and Unloading Method:
Manual Loading and Unloading
Safety Protection System:
Safety Grating, Leakage Protection Device, Two-Han
Trademark:
Tjin
Transport Package:
Crate Box
Origin:
China
Product Description
Guangdong Taijin Semiconductor Co., Ltd. was established in September 2010, located in Shangjiao Community, Chang'an Town, Dongguan City, China. Right now have two production base in Jiaxing and Dongguan (Headquarter), with total 280 employees of more than 200 sets of machine delivery to different area across the world.
Taijin is a high technology manufacturer in leadframe transfer molding,MGP mold,semiconductor chip encapsulation process machines include:Auto molding system,Manual molding machine,Trim&form system,degating machine.Most of the machine have the CE certification.Use reliable components ,which could ensure the long life and high precision running.
Company have gained IS09001 quality management system and ISO14001 environment certification, Welcome to support you and make progress together!
Semi-auto molding machine is used for the trial or the R&D process of the New package which is used for the Epoxy molding compound.
It could manage of 8 stage of pressure force controlling ,and help to analysis the details of the processing.
Application range:
Small batch production, mold testing, laboratory, teaching instruments
Main parameters:
Mold clamping pressure: 98-1176kN
Injection pressure: 1-29.4kN, 8-stage injection speed adjustable
Applicable lead frame/substrate size: width 20-90mm, length 124-
300mm, thickness 0.15-1.2mm
Applicable plastic sealing material specifications: Diameter: Φ11-Φ20mm(±0.2mm), length < 35mm
Control system: PLC (Omron); pressure curve output and storage
Safety protection system: safety grating, leakage protection device, two-hand button device, safety protection door
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Available options:
Mold vacuum system and isolation film system; dual presses can be connected in parallel to install different molds and test molds at the same time
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