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Semiconductor Automatic Chip Laying Machine for Semiconductor IC Packaging Production

Price $1000000.00
Min Order 1 Piece
Availability In Stock
Shipping From Jiangsu, China
Popularity 270 people viewed
Send Inquiry View Full Page
Condition:
New
Warranty:
12 Months
Automatic Grade:
Automatic
Installation:
Vertical
Driven Type:
Electric
Product Name:
Automatic Film Arrangement Machine
Feature 1:
Guaranteed Quality
Feature 2:
Customized According to Needs
OEM/ODM Service:
Provided
Trademark:
Himalaya
Transport Package:
Customized or Wooden Box Packaging
Specification:
Standard Specifications
Origin:
China
Product Description
Product Description

Main Features

 

Equipment function: Using a robotic arm to automatically grasp and discharge the lead frame;

Applicable packaging: all packaging;
Control system: PLC (Omron)
Operating system: touch screen+operation buttons;
Safety protection system: emergency stop button device, light curtain protection device, and three side safety door design. After the protective door is opened, the system stops all actions, and after the door is closed, it resumes continuous action to protect personal safety.

 

Semiconductor automatic chip laying machine, also known as automatic chip laying equipment, is an important part of realizing the automation of semiconductor IC packaging production. The main processes of IC packaging include: feeding, rail transportation, and chip laying and preheating. The chip laying machine mainly plays a role in automatic chip laying and heating during the production process, and its completion quality will directly affect the efficiency and quality of the next step of packaging. The current packaging technology requires automatic lamination machines to complete lamination work at high speed, accurately, and automatically preheat evenly.

Sample Display
 

 

 
 
Exhibition & Customers


Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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