Semiconductor Automatic Loader

Equipment function:

Use a robot to automatically grab and discharge the lead frame

Applicable packages: all packages

Control system: PLC (Omron)

Operating system: touch screen + operation buttons

Safety protection system: emergency stop button, light curtain protection device and three-sided safety door design. The system stops all actions after the door is opened and resumes continuous action after the door is closed to protect personal safety

Semiconductor automatic chip arrangement machine, also known as automatic chip arrangement equipment, is an important part of realizing the automation of semiconductor IC packaging production. The main processes of IC packaging include: loading, rail transportation, chip arrangement, and preheating. The chip arrangement machine mainly plays the role of automatic chip arrangement and heating in the production process. Its completion quality will directly affect the efficiency and quality of the next step of packaging. The current packaging technology requires the automatic chip arrangement machine to complete the chip arrangement work at high speed and accuracy, and automatically and evenly preheat