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Semiconductor Industry Wafer ID Marking Equipment with Fully Automatic Visual Positioning
| Price | Negotiable |
|---|---|
| Min Order | 1 Piece |
| Availability | In Stock |
| Shipping From | Jiangsu, China |
| Popularity | 267 people viewed |
After-sales Service:
Provided
Warranty:
12 Months
Laser Visibility:
Visible
Laser Classification:
Semiconductor Laser
Product Name:
Fully Automatic Wafer ID Marking Equipment
Feature 1:
High Precision
Feature 2:
High Efficiency
After-Sale Service:
Provided
Trademark:
Himalaya
Transport Package:
Customized or Wooden Box Packaging
Specification:
Standard Specifications
Origin:
China
Product Description
Semiconductor Industry Wafer ID Marking Equipment with Fully Automatic Visual Positioning
Fully automatic wafer ID marking equipment
Equipment features:
Adopting high-precision two-dimensional linear motor platform, DD motor wafer dual arm handling robot, fully automatic visual positioning, and equipment configuration with marking content verification function
Application scope:
Suitable for marking 2D codes, one-dimensional codes or characters on wafer substrates of 2-6 inch, 4-8 inch, 8-12 inch Si, SiC, InP, GaSb, GaN, Sapphire, Glass, LT and other materials
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choose us?
A3:OEM/ODM/Designing service.
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