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Transverse Wafer Grinder Thinning Polishing
| Price | $60000.00 |
|---|---|
| Min Order | 1 Piece |
| Availability | In Stock |
| Shipping From | Guangdong, China |
| Popularity | 244 people viewed |
Model NO.:
FD-300
After-sales Service:
12months
Warranty:
12months
Type:
Surface Grinding Machine
Processing Object:
Flat Workpieces
Abrasives:
Grinding Wheel
Controlling Mode:
PLC
Automatic Grade:
Semiautomatic
Cylindrical Grinder Type:
Surface Grinding Machine
Precision:
High Precision
Certification:
ISO 9001
Condition:
New
Power Source:
Electricity
Disc(Wheel) Type:
Grinding Disc
Variable Speed:
with Variable Speed
Type:
Thinning Equipment
Application:
Grinding Industry
Working Style:
Thinning
Service:
Oversea Setup & After-Sale Avalaible
Class:
Thinner
Process Station:
1
Abrasive:
Recyclable Water & Grinding Wheel
Wheel Rotate Speed:
0-3000 Rpm
Workpiece Accuracy Control(Parallelism):
1um
Power of Grinding Wheel Motor:
5.5kw
Trademark:
PONDA
Transport Package:
Wood Crate
Origin:
China
Product Description
Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Products Show
1. The thickness of 150-diameter wafer can be reduced to 0.08mm thick without breaking. And parallelism and flatness can be controlled within the range of ±0.002mm.
2. High thinning efficiency, LED sapphire substrate grinding speed can be reduced by up to 48 microns per minute. The wafer can be reduced by up to 250 microns per minute.
3. Series grinding machine using CNC program control system, touch screen operation panel.
APPLICATION
SPECIFICATION
SAMPLE DEMONSTRATION (THINNING)
Patent
Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
Packing Details : Packing, 1 pcs/carton.
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Products Show
1. The thickness of 150-diameter wafer can be reduced to 0.08mm thick without breaking. And parallelism and flatness can be controlled within the range of ±0.002mm.
2. High thinning efficiency, LED sapphire substrate grinding speed can be reduced by up to 48 microns per minute. The wafer can be reduced by up to 250 microns per minute.
3. Series grinding machine using CNC program control system, touch screen operation panel.
APPLICATION
| Process | Industry by Substance | Industry by Applicability | |
| High Speed Grinding & Thinning | Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone | Sealing | sealing ring(liquid, oil, gas) |
| Semiconductor | substrate(Al2O3, Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) used in Wafer, LED., etc | ||
| Plastic | Hard Plastic | ||
| Optics(flat) | optical lens, optical reflector, holographic glass, HUD glass, screen glass | ||
| Gemstone | jade, sapphire, agate, etc. | ||
| Others | gauge block, micrometer gauge, friction plate, metal components, and any other precise hardware. | ||
| *NOTE: spiral stripe appears after high speed grinding and thinning. To dispel it, lap or polish are needed. | |||
SPECIFICATION
| Standard Specification | ||||||
| Machine Model | FD170T | FD220T | FD320T | FD450T | ||
| Station Diameter | Φ150 mm / 6 inches | Φ220 mm / 8 inches | Φ320 mm / 12 inches | Φ460 mm / 18 inches | ||
| Max. Workpiece Dimension | Φ150×30 mm | Φ220×50 mm | Φ320×50 mm | Φ460×50 mm | ||
| Process Thickness | 50μm≤N | 75μm≤N | 95μm≤N | 120μm≤N | ||
| Grating Resolution | 0.5 μm | 0.5 μm | 0.5 μm | 0.5 μm | ||
| Number of Station | 1 | 1 | 1 | 1 | ||
| Wheel Rotate Speed | 0-3000 rpm | 0-3000 rpm | 0-3000 rpm | 0-3000 rpm | ||
| Station Rotate Speed | 0-300 rpm | 0-300 rpm | 0-300 rpm | 0-300 rpm | ||
| Total Weight | 650 kg | 850 kg | 900 kg | 920 kg | ||
| Total Floor Space | 1200×550 mm | 1150×1200 mm | 1150×1200 mm | 1150×1200 mm | ||
| Built-In Optional Kits | ||||||
| Grade | Standard | Advanced | ||||
| Slurry Recycle System | - | Integrated with PLC | ||||
| Dressing System | - | Integrated with PLC | ||||
| Station Fixing | Mechanical Fixture | Pneumatic Vacuum Fixing | ||||
| Spindle | Mechanical | Pneumatic | ||||
| *NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary. | ||||||
SAMPLE DEMONSTRATION (THINNING)
Patent
About the Company
Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people
Delivery & Packing
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.
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