15+ Years Experienced Turnkey PCB PCBA Board SMT Assembly Services for Electronic Industry China Wholesale PCB and PCBA Assembling

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Shenzhen Yongchangtai Electronics Co., Ltd.

VIP   Audited Supplier 2 years
Profile Certified by SGS/BV
YCTBJ-253
Tin
SMT
Multilayer
FR-4
RoHS, CCC, ISO
Customized
New
YCT
Bubble Anti-Static Bag
Custom
China
8534009000
Product Description

We provide the PCBA/ PCB one-stop custom services/ PCBA Custom service.


Custom Production Capacity

PCB custom capacity

ItemMass ProductionPilot Run Production
CapacityCapacity
Layer Counts1L-18L, HDI20-28 , HDI
MaterialCEM1,CEM3,FR-4, High TG FR4 , Halogen-free FR4 , aluminium ,Ceramic(96% Alumina)
PTFE(F4B,F4BK), Rogers(4003,4350,5880)Taconic(TLX-8,TLX-9), Arlon(35N,85N)etc.
Material Mixed Laminate4 layers -- 10 layers12 layers
FR4+Ro4350 , FR4+Aluminium , FR4+ Polyimide
Maximum Size610mm X 1200mm1200 - 2000MM
Board Outline Tolerance±0.15mm±0.10mm
Board Thickness0.125mm--6.00mm0.1mm--8.00mm
Thickness Tolerance ( t≥0.8mm)± 8%±5%
Thickness Tolerance( t<0.8mm)±10%±8%
Minimum Line / Space0.10mm0.075mm
Trace width Tolerance15%-20%10%
Minimum Drilling Hole (Mechanical)0.2mm0.15mm
Minimum laser hole0.1mm0.075mm
Hole Position/hole Tolerance±0.05mm           PTH:±0.076MM     NPTH:±0.05mm
Mini hole ring (single0.075MM0.05MM
OutLayer Copper Thickness17um--175um175um--210um
InnerLayer Copper Thickness17um--175um175um--210um
Mini Solder Mask Bridge0.05mm0.025mm
Impedance Control Tolerance±10%±5%
Surface FinishingHASL, Lead free HASL, Immersion gold, Immersion tin, Immersion Silver.
Plated gold , OSP, Carbon ink,
Acceptable File FormatALL Gerber Files,POWERPCB,PROTEL,PADS2000,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 etc.
Quality StandardsIPC-A-600F and MIL-STD-105D CHINA GB<4588>

 

PCBA custom Capacity

 

  Stencil Size

   736x736mm
   Minimum IC Pitch   0.2mm
   Maximum PCB size  510X460mm
   Minimum PCB thickness   0.5mm
   Minimum chip size:   0201 (0.2x0.1)/0603 (0.6 x 0.3mm)
   Maximum BGA size:   74x74mm
   BGA ball pitch:   1.00mm (minimum), 3.00mm (maximum)
   BGA ball diameter:   0.40mm (minimum), 1.00mm (maximum)
   QFP lead pitch:   0.38mm (minimum), 2.54mm (maximum)
  Machine Type  Panasnic CM 402
  Panasnic DT301
  Panasnic CM 402  patch speed:0.06sec/ chip (up to 60,000cph)
  Patch precision:±0.03~±0.005mm
  PCB size:max:510X460mm,min:50X50mm
  element size: 0603mm-50X50mm
  Panasnic DT301   patch speed:0.7sec/ chip
  Patch precision:±0.03~±0.005mm
  PCB size:max:510X460mm,min:50X50mm
  element size: 1005mm-100X90mmX25mm  high speed multifunctional mounter
   Volume:   One piece to low volume production quantities
   Low cost first prototype Fab
Fast deliveries
   Assembly type:   SMT assembly
   DIP assembly
   Mixed(surface mount and through hole) technology
   Cable assembly
   Components type:   Passive components
   As small as 0402 package
   As small as 0201 with design review
   Ball Grid Arrays(BGA):
   As small as .5mm pitch
   Component source  Shar,poshiba, ST, 
  Samsng, Infineon, Ti,
  ON,Microchip etc.
   Parts procurements:  provide one-stop services
  Only Assembly service (you supply the parts)
   You supply some parts(expensive/important components), we do the rest
   Solder type:   Leaded
   Lead-free/ROHS compliant
   Other capabilities:   Repair/rework services
   Mechanical assembly
   Box build
   Mold and plastic injection.
  Testing Type    First prototype test before mass quantity production
   AOI 
   BGA X-ray
   PCB E-test
Lead time  According Digikey components delivery time


Besides, we also offer the customization of all kinds of wiring harness.
• We offer the production and assembling of various electronic cables and communication cables.
• In the aspects of opening, crimping, pre- assembly, and final assembly, we would use verified materials and professional automation equipment.
• To realize the whole process control of quality, we would use the wiring harness detector to test the first piece.






Packaging
Strong pac kaging, not easily to be damaged or deformed during the long-distance transportation.


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