MadeInChina.com > Electrical & Electronics > Circuit Board > Rigid PCB

18/00 1.0mm 41"X49" Fr4 Copper Clad Laminate Sheet Ccl for PCB

Price	$35.00 Compare
Min Order	250 sheet
Availability	In Stock
Shipping From	Hainan, China
Popularity	456 people viewed
Quantity	+-

Haikou Haojinghui Industrial Co., Ltd.

Audited Supplier 7 years

Profile Certified by SGS/BV

Hainan, China
Elaine (Ms.)
General Manager

Visit Homepage Product Catalog

Product Detail
Contact Supplier

Model NO.:

FR4

Structure:

Single/Double-Sided Rigid PCB

Dielectric:

FR-4

Material:

Epoxy Fiber Galss Laminate

Application:

Consumer Electronics

Flame Retardant Properties:

V0, V1

Processing Technology:

Electrolytic Foil

Production Process:

Additive Process

Base Material:

Epoxy Fiber Galss

Insulation Materials:

Epoxy Resin

Brand:

Hjh

Sheet Thickness:

0.05-3.5mm

Copper Thickness:

18um, 35um, 105um, Others

Color:

Yellow

Market:

Euro, Asia, Central and South America

Trademark:

HJH

Transport Package:

Pallet

Specification:

41"x49", 43"x49", 1040x1245mm, 1090x1245mm, others

Origin:

China

HS Code:

7410211000

Product Description

FR4 Copper Clad Laminate Sheet

1.FEATURES
--Tg135±5ºC(DSC)
--Halogen-free, Br/Cl content below 900ppm
--UV Blocking/ AOI Compatible
--Antimony-free
--Conform to claim of RoHS
--IPC-4101B specification is applicable

2.APPLICATION
Computer,Mobile phone, Electronics Instrumentations Communication equipments etc.

3.TECHNICAL DATA SHEET

Test Items		Unit	Test Condition	Test Method IPC-TM-650	Specification	Typical Value
Tg		ºC	DSC	2.4.25	≥130	135
Peel strength 1oz		N/mm	288ºC, 10s	2.4.8	≥1.05	1.45
Flammability		Rating	C-48/23/50	UL94	V-0	V-0
Flammability		Rating	E-24/125	UL94	V-0	V-0
Surface Resistivity		MΩ	C-96/35/90	2.5.17.1	10⁴	2.0 X10⁶
Volume Resistivity		MΩ-cm	C-96/35/90	2.5.17.1	10⁶	5.0 X10⁸
Arc Resistance		S	D-48/50+D-0.5/23	2.5.1	60	124
Dielectric Breakdown		KV	D-48/50+D-0.5/23	2.5.6	40	56
Dielectric Constant (1MHz)		_	C-24/23/50	2.5.5.2	<5.4	4.7
Dissipation Factor (1Mhz)		_	C-24/23/50	2.5.5.9	<0.035	0.016
Thermal Stress	Unetched	Sec	288ºC, solder dip	2.4.13.1	≥30	Pass
Thermal Stress	Etched	Sec	288ºC, solder dip	2.4.13.1	≥30	Pass
Flexural Strength	LW	MPa	A	2.4.4	415	565
Flexural Strength	CW	MPa	A	2.4.4	345	430
Water absorption		%	D-24/23	2.6.2.1	0.35	0.21
CTE Z-axis	Before Tg	μm/mºC	TMA	2.4.24	≤60	50
	After Tg	μm/mºC	TMA		≤300	280
	50~260ºC	%	TMA		≤3.0	2.9
Td		ºC	10ºC/min, N_2,5% Wt Loss	2.4.24.6	≥340	340
T260		Min	TMA	2.4.24.1	-	15
T288		Min	TMA	2.4.24.1	-	2