Audited Supplier
Aluminium PCB-4
Rigid Circuit Board
V0
Aluminium
Aluminum
Organic Resin
Rigid
Aluminum
0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.2mm
1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K
Jh,Ccaf.etc
3-5days
ZAPON
Vacuum Packing
SGS UL ISO
China
85340090
Product Description
Product Description:
Aluminum base copper-clad laminate have excellent flame retardant, high mechanical strength, dimensional stability etc. Especially it has very good heat sink, electromagnetic shielding and solder float.
It's widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc.
Note: We specially produces Metal Base Copper-Clad Laminates, and our products have been compiled series with all complete specifications.
The tapy and specification of Aluminum based Laminates CCAF-01, CCAF-04-A, CCAF-05etc. And 0.8mm, 1.0mm, 1.5mm, 2.0mm, etc.
Thickness of the copper: 18um, 35um, 70um, 105um.
Base size: 500mm ×, 600mm (20"×, 24"); 600mm ×, 1060mm (24"×, 42")
CCAF-01 Aluminum-base copper-clad laminate
The test base: CCAF-01 the high heat dissipation Aluminum-base copper-clad laminate
Thickness of the copper: 35um
Thickness of the diclectric: 70um
Thickness of the aluminum-base: 1.5mm
Technique parameter:
Aluminum base copper-clad laminate have excellent flame retardant, high mechanical strength, dimensional stability etc. Especially it has very good heat sink, electromagnetic shielding and solder float.
It's widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, sound box, power supply module and acoustics shielding system etc.
Note: We specially produces Metal Base Copper-Clad Laminates, and our products have been compiled series with all complete specifications.
The tapy and specification of Aluminum based Laminates CCAF-01, CCAF-04-A, CCAF-05etc. And 0.8mm, 1.0mm, 1.5mm, 2.0mm, etc.
Thickness of the copper: 18um, 35um, 70um, 105um.
Base size: 500mm ×, 600mm (20"×, 24"); 600mm ×, 1060mm (24"×, 42")
CCAF-01 Aluminum-base copper-clad laminate
The test base: CCAF-01 the high heat dissipation Aluminum-base copper-clad laminate
Thickness of the copper: 35um
Thickness of the diclectric: 70um
Thickness of the aluminum-base: 1.5mm
Technique parameter:
| Test item | Technology request | Unit | Test result | |||
| 1 | Peel Strength | A | ≥ 1.8 | N/mm | 2 | |
| After thermal stress (260ordm;C) | ≥ 1.8 | N/mm | 1.8 | |||
| 2 | Blister test AfterThermal stress (260ºC, 2min ) | No delaminating | / | Ok | ||
| 3 | Flammability(A) | FV-O | / | FV-O | ||
| 4 | Thermal resistance | ≤ 2.0 | ordm;C /W | 1 | ||
| 5 | Surface Resistivity | A | ≥ 1 × 10 5 | M Ω | 5 × 10 7 | |
| Constant humidity treatment | ≥ 1 × 10 5 | M Ω | 2 × 10 6 | |||
| (90%,3 5 ordm;C,96h) | ||||||
| 6 | Volume Resistivity | A | ≥ 1 × 10 6 | M Ω· m | 4 × 10 8 | |
| Constant humidity treatment | ≥ 1 × 10 6 | M Ω· m | 5 × 10 7 | |||
| (90%,3 5ordm;C ,96h) | ||||||
| 7 | Dielectric Breakdown ( DC ) | ≥ 28.5 | Kv/mm | 31 | ||
| 8 | Dielectric constant (1MHz ) | ≤ 4.4 | / | 4.2 | ||
| (40 ordm;C,93% , 96h ) | ||||||
| 9 | Dielectric dissipation factor (1MHz ) | ≤ 0.03 | / | 0.02 | ||
| (40 ordm;C, 93% ,96h ) | ||||||
