Audited Supplier
New Product-11
Single-Sided Rigid PCB
Aluminium
V0
Electrolytic Foil
Subtractive Process
Organic Resin
Hal, HASL, OSP
0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm, 2.2mm
1.0W/M.K, 1.5W/M.K, 2.0W/M.K, 3.0W/M.K, 4.0W/M.K
3-5days
DJ
Vacuum Packing
SGS UL ISO
China
85340090
Product Description
Material: Aluminium
Layer Coverage: 1Layer
Thickness: 1.6mm
Surface Technique: HAL, HASL, OSP
Line Width/Space: 0.2mm
Thermal Conductivity: 1.0W/mk, 2.0W/mk, 3.0W/m. K
Copper: 1oz. 2oz. 3oz
Solder Mask Color: White, black.
Features:
1.3D foldable aluminum base LED board make the light 360 angles illuminate!
2. Mainly used in automobile fields, foldable LED light can meet car lamp all requirements, which can be folded to any shape to make the head lamp more beautiful, meanwhile aluminum base LED light has very good heat dissipation function, which make the lamp life more longer.
3.3D LED light make the energy fully used, it is energy saving and environmentally friendly.
Layer Coverage: 1Layer
Thickness: 1.6mm
Surface Technique: HAL, HASL, OSP
Line Width/Space: 0.2mm
Thermal Conductivity: 1.0W/mk, 2.0W/mk, 3.0W/m. K
Copper: 1oz. 2oz. 3oz
Solder Mask Color: White, black.
Features:
1.3D foldable aluminum base LED board make the light 360 angles illuminate!
2. Mainly used in automobile fields, foldable LED light can meet car lamp all requirements, which can be folded to any shape to make the head lamp more beautiful, meanwhile aluminum base LED light has very good heat dissipation function, which make the lamp life more longer.
3.3D LED light make the energy fully used, it is energy saving and environmentally friendly.
| Test item | Technology request | Unit | Test result | ||||
| 1 | Peel Strength | A | ≥ 1.0 | N/mm | 1.05 | ||
| After thermal stress (260 ordm;C ) | ≥ 1.0 | N/mm | 1.05 | ||||
| 2 | Blister test AfterThermal stress (288 ordm;C, 2min) | 288ordm;C 2 min No delaminating | / | OK | |||
| 3 | Themal Resistance | ≤ 2.0 | ordm;C /W | 0.65 | |||
| 4 | Flammability(A) | FV-O | / | FV-O | |||
| 5 | Surface Resistivity | A | ≥ 1 × 10 5 | M Ω | 5.0 × 10 7 | ||
| Constant humidity treatment (90%,3 5 ordm;C ,96h) | ≥ 1 × 10 5 | M Ω | 4.5 × 10 6 | ||||
| 6 7 | Volume Resistivity | A | ≥ 1 × 10 6 | M Ω@ m | 1.0 × 10 8 | ||
| Constant humidity treatment (90%,3 5 ordm;C ,96h) | ≥ 1 × 10 6 | M Ω@ m | 1.9 × 10 7 | ||||
| 8 | Dielectric Breakdown (DC ) | ≥ 25 | Kv/mm | 31 | |||
| 9 | Dielectric constant (1MHz) (40 ordm;C, 93% , 96h) | ≤ 4.4 | / | 4.2 | |||
| 10 | Dielectric dissipation factor (1MHz ) (40ordm;C ,93%,96h) | ≤ 0.03 | / | 0.029 | |||
| Accelerated aging experiment (125 ordm;C ,2000h) | The laminate bace should no wrinkles,no crack,no delaminating or no pine | / | OK | ||||
| 11 | High low temperature impact test (-50 ordm;C, 15min, 80ordm;C , 15minTOTAL DO 15 ~ 20 Circulation) | Peel Strength | / | N/mm | 1.39 ~ 1.64 | ||
| Surface Resistivity | / | M Ω | 1.9 × 10 8 ~6.4 × 10 8 | ||||
