Audited Supplier
CNC
CNC
AC220V
minder-hightech
620*610*560mm
Guangzhou
8015809090
Product Description
Product Description
Heavy wire bonder
Here we provide 7 types of most competitive wire bonder, 4 Types of manual wire bonder, and 3 types of automatic wire bonder.
The most competitive 4 types: thin aluminum wire wedge bonder MDB-2575(25-75um aluminum wire);Wire wedge bonder MDB-25125(25-125um aluminum wire); heavy aluminum wire wedge bonder MDB-7550(75-500um aluminum wire);gold wire ball bonder MDBB-1750(17-50um gold wire). they are very popular for small quantity production, school, institution, research department.
And the 3 automatic: automatic thin aluminum wire bonder MD-Etech1850(18-50um aluminum wire); automatic ball bonder MD-S800(15-50um Au or alloy wire); automatic heavy wire bonder MD-CWX-3710(125-500um Aluminum wire).
Applications
High power dynatron/FET/SCR, Power module, IGBT, High power Fast recovery diode, Schottky transistor, Lead attachment, wire bonding, TO-3,TO-3P,TO-3PF,TO-3PN,TO-3PL,TO-220F,TO-126,TO-12F,TO-66,TO-251,TO-202 etc.
Sample
Specification
Factory
Packing & Delivery
To better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided.
Detail display
Heavy wire bonder
Here we provide 7 types of most competitive wire bonder, 4 Types of manual wire bonder, and 3 types of automatic wire bonder.
The most competitive 4 types: thin aluminum wire wedge bonder MDB-2575(25-75um aluminum wire);Wire wedge bonder MDB-25125(25-125um aluminum wire); heavy aluminum wire wedge bonder MDB-7550(75-500um aluminum wire);gold wire ball bonder MDBB-1750(17-50um gold wire). they are very popular for small quantity production, school, institution, research department.
And the 3 automatic: automatic thin aluminum wire bonder MD-Etech1850(18-50um aluminum wire); automatic ball bonder MD-S800(15-50um Au or alloy wire); automatic heavy wire bonder MD-CWX-3710(125-500um Aluminum wire).
ApplicationsHigh power dynatron/FET/SCR, Power module, IGBT, High power Fast recovery diode, Schottky transistor, Lead attachment, wire bonding, TO-3,TO-3P,TO-3PF,TO-3PN,TO-3PL,TO-220F,TO-126,TO-12F,TO-66,TO-251,TO-202 etc.
SampleSpecification| electric requiement: | 220VAC±10%,50HZ,be sure connected to ground |
| aluminium wire diameter: | 75~500μm (3~20mil) |
| ultrasonic power: | 0-30W, two channel.can be set separately of the two point |
| bond time: | 10-500ms,two channel |
| bond force: | 30-1200g,two channel |
| motorized Y: | 0-18mm |
| microscope rate: | 7.5 and 15 |
| working area: | Φ25mm |
| light: | adjustable brightness |
| size: | 620×610×560mm |
| weight: | ~40kg |
Packing & DeliveryTo better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided.Detail display
