Audited Supplier
bga160
Soldering Station
Platform
0.3-3rpm
250mm
0-135°
220V
Adjustable
New
≤ 20mm X20mm
3.5× 3.5mm
200W
220V, 50Hz
15kg
400 * 550 * 430mm
Torch
Wooden Case
400 * 550 * 430mm
Beijing, China
8514200009
Product Description
Desoldering worktable BGA900-IR
Introduction:
The desoldering worktable BGA900-IR is manufactured by our company which is heating by infrared ray in double-sided, can heat from the top and preheat at the bottom. Suit to welding, removal or repair BGA, PBGA, CSP and variety of packages, can meet the multi-layer PCB substrate and unleaded welding requirements. Configuration can be completed on the planting table BGA to plant the ball. The device repair wilding's mainly target is motherboards and graphics chip BGA of PC, desktops, switches, XBOX (including graphics chip, video card etc).
Features of BGA900:
Introduction:
The desoldering worktable BGA900-IR is manufactured by our company which is heating by infrared ray in double-sided, can heat from the top and preheat at the bottom. Suit to welding, removal or repair BGA, PBGA, CSP and variety of packages, can meet the multi-layer PCB substrate and unleaded welding requirements. Configuration can be completed on the planting table BGA to plant the ball. The device repair wilding's mainly target is motherboards and graphics chip BGA of PC, desktops, switches, XBOX (including graphics chip, video card etc).
Features of BGA900:
- Double infrared ray heating systems, can heating at the top of the components and the bottom of PCB at the same time, compared with the Cyclones, the heating process is more stable and avoid uneven heating of the PCB which can cause warp; the use of advanced infrared heating methods needn't replace the heating nozzle, this also save the cost of investment.
- Advanced temperature system: Independent heating from top to bottom and also independent temperature control, welding finished with the alarm function, all this characteristics can be more convenient and comfortable.
- Fashionable appearance: black full design, arc top heater, small size, and could be placed in a 400MM room.
- Chip oriention: Red laser BGA chips center orientation is easy to operate.
- Large area heating and preheating system: Top heating 80×80MM,bottom heating 200×200MM. It could be easy to deal with heavy thermal capacity PCB and other lead-free soldering.
- Integrative design: All-purpose orientation bracket and PING could achieve sustainment and fixation of big size PCB. So, it is easy to prevent and rectify some transformable mainboard, to fix up the PCB board and ensure the success of maintainment.
- Economical investment: Fully considered the reality of common maintain department, not only cut off the cost, but also ensure the quality.
- More users: small cubage, large warm-up area, very suit to computer mainboard, notebook PC, and individual maintain department. It is convenient to transport and convey.
| Specification | |
| Heat | infrared heating from top and bottom |
| Dimension | L400mm * W350mm * H410mm |
| Weight | About 15kg |
| Bracket | It is decided by customers' request. |
| Packing | It is decided by customers' request. |
| Packed weight | About 17kg |
| Electric parameters | |
| Input power | AC 220V 50Hz |
| Top heat | IR heating |
| Top heating size | 80mm* 80mm |
| Top heating power | 300W |
| Bottom heating | IR heating |
| Bottom heating size | 200mm* 200mm |
| Bottom heating power | 600W |
| Total power | 900W |
| Temperature controlling | |
| top heating controlling | Temperature controlling independently, high precision close loop controlling, error of the panel is 0.5% |
| top temperature measurement | High sensitive K temperature sensor, monitoring temperature directly |
| Bottom heating controlling | Temperature controlling independently, high precision close loop controlling, error of the panel is 0.5%, with alarm. |
| Bottom temperature measurement | High sensitive K temperature sensor, monitoring temperature directly |
| Repairing function | |
| Application | For soldering, unsoldering, repairing BGA QFP CSP and semi conductors. |
