Audited Supplier
Used for electric components soldering in SMT production line, LED, high precision IC, scale board solering assembly.
| Parameters | T8L | T5L | T8(desktop) | T5(desktop) | T5S(desktop) | |
| L*W*H(mm) | 2100x712x1220 | 1800x600x1220 | 2100x712x500 | 1800x600x500 | 1400x555x375 | |
| N.W.(KG) | 230 | 160 | 180 | 130 | 100 | |
| Peak power(KW) | 11.6 | 7.8 | 11.6 | 7.8 | 5.8 | |
| Working power(KW) | 5 | 3.5 | 5 | 3.5 | 2 | |
| Voltage(V) | 380/220 | 380/220 | 380/220 | 380/220 | 380/220 | |
| Conveyor width(mm) | 300 | 300 | 300 | 300 | 300 | |
| Available height(mm) | 25 | 25 | 25 | 25 | 25 | |
| Max.conveyor speed (mm/min) | 1000 | 1000 | 1000 | 1000 | 1000 | |
| Heating area length (mm) | 1210 | 1000 | 1210 | 1000 | 900 | |
| T5 Five zones | First/ Forth:Fast preheating zone Second:Drying zone Third/Fifth:Soldering zone Fourth/Fifth:Bottom-side heating zone (Each zones adapts independent heating/cooling control ways,cooling zone belongs to strong wind refrigerating system.) | |||||
| T8 Eight zones | First/Fifth:Fast preheating zone Second/Third/Sixth/Seventh:Drying zone Forth/Eighth:Soldering zone Fifth/Sixth/Seventh/Eighth:Bottom-side heating zone (Each zones adapts independent heating/cooling control ways,cooling zone belongs to strong wind refrigerating system.) | |||||
What is reflow soldering
The basic process behind reflow or to provide its full name, infra-red reflow soldering requires that solder paste is applied to the relevant areas of the board.
The components are then placed, and then the assembly is passed through a tunnel where the board is heated in a controlled manner so that the solder paste melts and the components are electrically secured to the printed circuit board.
Using reflow soldering technology it is possible to reliably solder surface mount components, and particularly those with very fine pitch leads. This makes it ideal for use with the components used in mass produced electronics products.
What is a brief SMT process
Preparation board/ solder paste→ Screen printing→ Component placement→ Component inspection→ Reflow soldering→ Cleaning→ Solder joint inspection→ Cicuit testing→ Packaging → Finish.
