Audited Supplier
GC-TG302
Low Oil Level, Electrical Insulation
Whith&Grey
6 Month
Sealed 25ºC Shade
One-Stop Solution
7*24hour Service
Gold-cool
Shipping/Rail/Express
2kg/bottle
China
3824999999
Product Description
CPU Graphics Card High Temperature Resistance Heat Conduction Silicone Phone Heat Dissipation Silicone
This product is made from organic silicone as the main raw material, add the thermal conductive filler of heat resistant ,heat conduction performance ,type made of heat conduction of organic silicon resin compounds, commonly known as the cooling paste, used in power amplifier, transistors, electron tubes, electronic components such as CPU heat conduction and heat dissipation, so as to ensure the electrical properties of electronic instruments, meters, etc.
1.Has excellent electrical insulation, good thermal conductivity, low oil level.
2.Product has low precipitation, low permeability oil rate, good thixotropy, easy to use.
3.Excellent high and low temperature resistance, excellent weather resistance, radiation resistance and excellent dielectric properties.
4.Environmental non-toxic, meet environmental requirements of ROHS and UL
Application:
PC CPU
Heat sinks,cooling modules
Power tuble.alactric heating reactor,converter
Power supply
TV,LED lighing
Wire equipment
2.Product has low precipitation, low permeability oil rate, good thixotropy, easy to use.
3.Excellent high and low temperature resistance, excellent weather resistance, radiation resistance and excellent dielectric properties.
4.Environmental non-toxic, meet environmental requirements of ROHS and UL
Application:
PC CPU
Heat sinks,cooling modules
Power tuble.alactric heating reactor,converter
Power supply
TV,LED lighing
Wire equipment
| General Product Attribute Table | ||||||
| Project | Unit | GC-TG102 | GC-TG150 | GC-TG251 | GC-TG302 | Testing Standard |
| Color | - | white | Grey | white | Grey | - |
| Density | g/cm3 | 2.3±0.2 | 2.5±0.2 | 2.9±0.2 | 3.7 | ASTM D792 |
| Thermal Conductivity | W/m.k | 1±0.2 | 1.5±0.2 | 2.5±0.2 | 3±0.2 | ASTM D5470 |
| Thermal resistance | ºC*cm2/W | 0.24 | 0.2 | 0.23 | 0.08 | - |
| penetration | 0.1mm 25ºC | 300±20 | 310±20 | 310±20 | 285±20 | GB/T269 |
| Thermogravimetric Loss | % | <1.0 | @150ºC/24H | |||
| Temperature Range | ºC | -40ºCto200ºC | EN344 | |||
| Storage life | month | 6(under seal) | - | |||
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