Audited Supplier
FONIETO-1
Tin
SMT
1-22 Layers
FR-4
RoHS, CCC, ISO, Ts16949
Customized
New
Green;Red;Yellow;Black;White
No Limited
Retangular, Round, Slots, Cutouts, Complex, Irreg
HASL, Gold Finger, OSP, Enig, Peelable Mask
OEM, ODM
Inner Vacuum Packing Outer Carton Box
FR 4, 0.8mm, 1 Layer, 1OZ Copper Thickness
China
8534009000
Product Description
| Delivery time | Samples | 5pcs ~ 100pcs | 1 Day | All the above time starts after all components and PCB materials are ready |
| Small batch | 101pcs ~ 5000 pcs | 3 Days | ||
| Medium batch | 5001pcs ~ 10000 pcs | 5 Days | ||
| Large batch | >10001pcs | 15 Days | ||
| Production capacity | SMT 2 million points/day; DIP 250,000 points/day; 5-10 models/day | |||
| Component Range | Min. 01005(0.4mm*0.2mm) Max. 55mm(H25mm) | |||
| PCB Size | Min. 50mm*50mm (Suggest >100mm*100mm) Max. 460mm*1200mm | |||
| Max. Thickness | The batch size is not more than 3 mm, and the model is unlimited | |||
| Placement Accuracy | +/- 40micrometer (Chip) +/- 30micrometer (IC) | |||
| PCB Types | PCB rigid board (FR-4, metal substrate), PCB flexible board (FPC), soft and hard PCB | |||
| File Format | Bill of Materials (BOM), PCB files (Gerber files and PCB design format files), coordinate files | |||
| Solder paste tin wire tin bar | Lead-free solder paste, customed solder paste, Brand solder paste | |||
| Steel Mesh | Laser stencil IC and BGA components can reach PC-2 Class | |||
| Component Packaging | We accept SMT components in reel, cutting tape, tube, tray, etc. which can be packed on the machine. DIP components can be packed in bulk. | |||
| Component Purchase Service | 1 Foundry only (Customers provide PCB and components) 2 Part of the substitute materials (customers provide core components and special components, we can purchase other components on behalf of us) 3 A full set of substitute materials (reduce purchase cost and communication cost) | |||
| Test | 1, IQC: Incoming inspection 2,IPQC: In-production inspection 3, Visual QC: regular quality inspection 4,On-line AOI: Check the soldering effect of solder paste, SMD components, few parts or component polarity. 5, X-Ray:Check BGA, QFN and other high-precision hidden PAD components. 6,Test function and performance according to customer's test procedures and steps. 7, Aging test: According to the customer's test time for aging. | |||
