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CuNi 2/NC005/Electric Alloy Material Resistance Heating Wire
Copper Nickel 2 s a copper nickel alloy with the addition of Manganese to produce an alloy with a relatively low resistivity but high resistance to oxidation and chemical corrosion. Maximum working temperature is 500 °C. Applications include heating cords and mats
III Main Advantage and Application
A. Physical parameter:
1) Wire diameter: 0.025 ~ 15mm
2) Pure nickel has the ability to withstand relatively high temperatures without deterioration. Maximum operating temperature is approximate 600°C
3) Nickel wire is available in single strand or multi-strand construction. It is supplied from stock either bare, or insulated
B. Characteristics:
1) Excellent straightness
2) Uniform and beautiful surface condition without spots
3) Excellent coil-forming ability
C. Main applications and general purpose:
1) This wire can also be widely used in generally specified for transistor caps, anodes for electronic tubes, leads of electronic components / lead-in-wires for lamps and for wire-mesh. Also used in strip form for various applications including Ni-Cd batteries
2) Also used for cables, Lead-in-Wire for lamps, electronic tube supports, wire cloth electrical connecting leads where temperatures are in excess of those for which copper is suitable, wire weaving
3) Typical applications include: terminations for heating elements as in ovens, plastics extruders, furnaces. Filament supports and lead wires in the lighting industry
NC005 electric alloy material resistance heating wire
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| Chemical Composition and Main Property of Cu-Ni Low Resistance Alloy | |||||||
| Properties\Grade | CuNi1 | CuNi2 | CuNi6 | CuNi8 | CuMn3 | CuNi10 | |
| Main Chemical Composition | Ni | 1 | 2 | 6 | 8 | _ | 10 |
| Mn | _ | _ | _ | _ | 3 | _ | |
| Cu | Bal | Bal | Bal | Bal | Bal | Bal | |
| Max Continuous Service Temperature(ºC) | 200 | 200 | 200 | 250 | 200 | 250 | |
| Resisivity at 20ºC (Ω*mm²/m) | 0.03 | 0.05 | 0.1 | 0.12 | 0.12 | 0.15 | |
| Density(g/cm³) | 8.9 | 8.9 | 8.9 | 8.9 | 8.8 | 8.9 | |
| Thermal Conductivity(α×10-6ºC) | <100 | <120 | <60 | <57 | <38 | <50 | |
| Tensile Strength(Mpa) | ≥210 | ≥220 | ≥250 | ≥270 | ≥290 | ≥290 | |
| EMF vs Cu(μVºC)(0~1000ºC) | -8 | -12 | -12 | -22 | _ | -25 | |
| Approximate Melting Point(ºC) | 1085 | 1090 | 1095 | 1097 | 1050 | 1100 | |
| Micrographic Structure | austenite | austenite | austenite | austenite | austenite | austenite | |
| Magnetic Property | non | non | non | non | non | non | |
| Properties\Grade | CuNi14 | CuNi19 | CuNi23 | CuNi30 | CuNi34 | CuNi44 | |
| Main Chemical Composition | Ni | 14 | 19 | 23 | 30 | 34 | 44 |
| Mn | 0.3 | 0.5 | 0.5 | 1 | 1 | 1 | |
| Cu | Bal | Bal | Bal | Bal | Bal | Bal | |
| Max Continuous Service TemperatureºC) | 300 | 300 | 300 | 350 | 350 | 400 | |
| Resisivity at 20ºC (Ω*mm²/m) | 0.2 | 0.25 | 0.3 | 0.35 | 0.4 | 0.49 | |
| Density(g/cm³) | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | |
| Thermal Conductivity(α×10-6ºC) | <30 | <25 | <16 | <10 | <0 | <-6 | |
| Tensile Strength(Mpa) | ≥310 | ≥340 | ≥350 | ≥400 | ≥400 | ≥420 | |
| EMF vs Cu(μVºC)(0~1000ºC) | -28 | -32 | -34 | -37 | -39 | -43 | |
| Approximate Melting Point(ºC) | 1115 | 1135 | 1150 | 1170 | 1180 | 1280 | |
| Micrographic Structure | austenite | austenite | austenite | austenite | austenite | austenite | |
| Magnetic Property | non | non | non | non | non | non | |
