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Electronic 96% 99.6% Aluminium Oxide Sheet Thin Thick Film Circuit Al2O3 Plate High Alumina Ceramic Substrate for Semiconductor
Brief Introduction of Ceramic Substrates
Ceramic substrates are ideal packaging base materials for new generation integrated circuits and power electronic modules. Compared with plastic and metal substrates, ceramic substrates have the following advantages.
1. Good Insulation
Generally speaking, the higher the substrate resistance, the better the reliability of the package. Ceramic materials are generally covalent bond compounds with better insulation properties.
2. Low Dielectric Coefficient and Good Frequency Performance
The low dielectric constant and dielectric loss of ceramic materials can reduce the signal delay time and increase the transmission speed.
3. Small Coefficient of Thermal Expansion (CTE)
Covalent bond compounds generally have high melting points, and the higher the melting point, the smaller the thermal expansion coefficient, so the CTE of ceramic materials is generally small.
4. High Thermal Conductivity
Ceramic substrate materials are widely used in aviation, aerospace and other engineering projects for high-reliability, high-frequency, high-temperature-resistant and highly airtight product packaging. The packaging of ceramic substrate materials is generally a multilayer ceramic substrate package, which is widely used in hybrid integrated circuits (HIC) and multi-chip module (MCM) ceramic packages.
Material Properties
| Alumina Ceramic Substrate | ||||
| Item | Unit | 96% Al2O3 | 99.6% Al2O3 | |
| Mechanical Properties | ||||
| Color | / | / | White | White |
| Density | Drainage Method | g/cm3 | ≥3.70 | ≥3.95 |
| Light Reflectivity | 400nm/1mm | % | 94 | 83 |
| Flexural Strength | Three Point Bending | MPa | >350 | >500 |
| Fracture Toughness | Indentation Method | MPa·m1/2 | 3.0 | 3.0 |
| Vickers Hardness | Load 4.9N | GPa | 14 | 16 |
| Young's Modulus | Stretching Method | GPa | 340 | 300 |
| Water Absorption | % | 0 | 0 | |
| Camber | / | Length‰ | T≤0.3: ≤5‰, Others: ≤3‰ | ≤3‰ |
| Thermal Properties | ||||
| Max. Service Temperature (Non-loading) | / | ºC | 1200 | 1400 |
| CTE (Coefficient of Thermal Expansion) | 20-800ºC | 1×10-6/ºC | 7.8 | 7.9 |
| Thermal Conductivity | 25ºC | W/m·K | >24 | >29 |
| Thermal Shock Resistance | 800ºC | ≥10 Times | No Crack | No Crack |
| Specific Heat | 25ºC | J/kg·k | 750 | 780 |
| Electrical Properties | ||||
| Dielectric Constant | 25ºC, 1MHz | / | 9.4 | 9.8 |
| Dielectric Loss Angle | 25ºC, 1MHz | ×10-4 | ≤3 | ≤2 |
| Volume Resistivity | 25ºC | Ω·cm | ≥1014 | ≥1014 |
| Dielectric Strength | DC | KV/mm | ≥15 | ≥15 |
1. 96% Alumina
96% alumina is the standard material for thick film circuit substrates. It has excellent electrical insulation properties, mechanical strength, good thermal conductivity, chemical durability and dimensional stability. Its surface roughness is generally 0.2-0.6um, and the max. operating temperature of the substrate can reach 1600°C.
Picture 1 - Alumina Thick Film Circuit Board
2. 99.6% Alumina
99.6% alumina is the mainly used material in most thin film circuit substrates. It has higher purity and smaller grain size. When made into a substrate, it has the advantage of excellent surface smoothness (surface roughness generally 0.08-0.1um), and the max. operating temperature of the substrate can reach 1700°C.
Picture 2 - Alumina Thin Film Circuit Board
1. Product Specification
The table below shows our standard thicknesses and sizes. If you have customized needs, please contact us.
| Alumina Ceramic Substrate | |||||||
| 99.6% Al2O3 | |||||||
| Thickness (mm) | Maximum Size (mm) | Shape | Molding Technique | ||||
| As Fired | Lapped | Polished | Rectangular | Square | Round | ||
| 0.1-0.2 | 50.8 | 50.8 | √ | √ | Tape Casting | ||
| 0.25 | 114.3 | 114.3 | √ | Tape Casting | |||
| 0.38 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
| 0.5 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
| 0.635 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
| Other special thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping. | |||||||
| 96% Al2O3 | |||||||
| Thickness (mm) | Maximum Size (mm) | Shape | Molding Technique | ||||
| As Fired | Lapped | Polished | Rectangular | Square | Round | ||
| 0.25 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
| 0.3 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
| 0.38 | 140×190 | √ | Tape Casting | ||||
| 0.5 | 140×190 | √ | Tape Casting | ||||
| 0.635 | 140×190 | √ | Tape Casting | ||||
| 0.76 | 130×140 | √ | Tape Casting | ||||
| 0.8 | 130×140 | √ | Tape Casting | ||||
| 0.89 | 130×140 | √ | Tape Casting | ||||
| 1 | 280×240 | √ | Tape Casting | ||||
| 1.5 | 165×210 | √ | Tape Casting | ||||
| 2 | 500×500 | √ | Tape Casting | ||||
| Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping. | |||||||
2. Product Tolerances
| Alumina Ceramic Substrate | ||||
| Item | Substrate Thickness (mm) | Standard Tolerance (mm) | Best Tolerance (mm) | Laser Cutting Tolerance (mm) |
| Length and Width Tolerance | / | ±2 | ±0.15 | |
| Thickness Tolerance | T<0.3 | ±0.03 | ±0.01 | |
| 0.30-1.0 | ±0.05 | ±0.01 | ||
| T>1.0 | ±10% | ±0.01 | ||
3. Surface Roughness
| Alumina Ceramic Substrate | |||
| Material | Surface Roughness (μm) | ||
| As Fired | Lapped | Polished | |
| 96% Al2O3 | Ra 0.2-0.75 | Ra 0.3-0.7 | Ra ≤0.05 |
| 99.6% Al2O3 | Ra 0.05-0.15 | Ra 0.1-0.5 | Ra ≤0.05 |
4. Laser Processing
(1) Hole Size
| Alumina Ceramic Substrate | |
| Hole Diameter (mm) | Standard Tolerance (mm) |
| φ≤0.5 | 0.08 |
| φ>0.5 | 0.2 |
(2) Laser Scribing
| Alumina Ceramic Substrate | |
| Substrate Thickness (mm) | Laser Scribe Line Depth to Thickness (%) |
| 0.2-0.3 | 40%±5% |
| 0.3<T≤0.5 | 50%±3% |
| 0.5<T≤1.0 | 43%±3% |
| 1.2 | 55%±3% |
| 1.5 | 55%±3% |
| 2.0 | 55%+10% |
| The scribing spot can be in different sizes. Generally, there are small spots 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spots 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm. | |
We offer bare ceramic substrates in various raw materials, sizes, shapes, and thicknesses. Welcome to communicate with us.
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