Audited Supplier
FC700
on Site, 7daysx24hours Technical Support
1year
Semiconductor Packaging Flux Clean
Wet Cleaning
Automatic
Precision Industrial Cleaning
PLC
Chemical Cleaning
CE, CB, ETL, RoHS, UR
New
Customized
Clean Thoroughly
ACTSPRAY
Plywood and Vacuum Package
L7000*W1750*H1700mm
Dongguan, Guanddong, China
8479899990
Product Description
FC700 System Mainly used to clean flux residual and solder balls on FC/SiP chips after soldering. The system adopts SUS304 flat net conveyor transportation system; high pressure and high flow upper and lower spray cleaning process to wash,rinse and dry Chips(substrate) automatically.
Put in Chips → water vapor isolation → chemical liquid wash1 → chemical liquid wash2 →chemical liquid wash3→ chemical isolation → DI water pre-rinse → DI water rinse1 →DI wateer rinse2→ DI water final rinse → Air blow → hot air dry 1 → hot air dry 2 → send out chips
Put in Chips → water vapor isolation → chemical liquid wash1 → chemical liquid wash2 →chemical liquid wash3→ chemical isolation → DI water pre-rinse → DI water rinse1 →DI wateer rinse2→ DI water final rinse → Air blow → hot air dry 1 → hot air dry 2 → send out chips
- Wash1 section: Soften and decrease the biscosity of flux or dusts.
- Wash2&3 section:Wash flux and dusts particles on Chip(substrate).
- Chemical isolation section: Isolation liquid between wash and DI water pre-rinse section.
- Pre-rinse section: DI water rinse flux and liquid on Chip(substrate).
- Rinse1&2 section: Further rinse flux and ion contamination on Chip(substrate).
- Final rinse section: remove rinse ion contamination on Chip(substrate).
- Air blow section: Blow off DI water residual on Chip(substrate).
- Hot air dry section: Hot air blow to toast moisture on Chip(substrate).
