The products:
Single-side PCB: CEM-1, FR-2, FR-1 XPC-94HB
Double-side PCB: FR-4, CEM-3, High Tg, Aluminum, Halogen Free
Multi-layer PCB: 4 to 22 layers(FR-4, High Tg, Rogers)
Certification: UL, ISO9001, ISO/TS16949: 2002, IS014001 and RoHS
THE CAPACITY OF PRODUCTION: 50, 000SQM. /month
| Item | Capabilities | ||
| Number of Layers | Single side | ||
| Material | CEM-1,FR-2,FR-1,FR-4,XPC-94HB | ||
| PCB Thickness | Min.thickness | 0.8mm(32mil) | |
| Max.thickness | 1.6mm(63mil) | ||
Surface finished | Flux | ||
| Nickel Plating | |||
| Gold Plating | |||
| Hot Air Solder Leveling(HASL) | |||
| Entek Coating (OSP) | |||
| Solder Mask | Green,White,Black,Yellow,Red,Blue | ||
| Other printing | Silver through hole | ||
| Carbon Print, Peelable Mask | |||
| Carbon Through Hole | |||
| Copper thickness | 1/2 oZ(18 um) - 1 oZ (35 um) | ||
| Min. Hole Size | CNC-Drilled | 0.4mm (16 mil) | |
| Punched | 0.8mm (32 mil) | ||
| Hole Size Tolerance (CNC Drilled) | +/ -0.076mm (3 mil) | ||
| Hole Size Tolerance (Punched) | +/ -0.1mm (4 mil) | ||
| Min. Line Width and Spacing | 0.2mm (8 mil) | ||
| Min. Solder Mask Clearance (UV Cure) | 0.15mm (6 mil) | ||
| Min. Solder Mask Clearance (Thermal Cure) | 0.1mm (4 mil) | ||
| Min. Annular Ring | 0.15mm (6mil) | ||
| Profile and V-Cut | Stamping, V-Cut and Beveling,CNC | ||



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