Fr4 Copper Clad Laminate with High Mechanical Strength and Excellent Dielectric Properties for PCB

1. Introduction to FR4 copper clad laminate
FR4 is a fiberglass epoxy resin copper-clad laminate that is currently the most commonly used rigid printed circuit board (PCB) substrate material.
Material composition
Reinforcement material: Glass fiber cloth (E-glass) is used as reinforcement material. This glass fiber has high strength, high insulation and good heat resistance.
Resin matrix: Epoxy resin (Epoxy Resin) is used as the resin matrix. Epoxy resin has good adhesion, electrical properties and chemical stability.
Copper foil: One or both sides of the substrate are covered with copper foil. The copper foil is usually attached to the substrate through electroplating or lamination and is used to form the conductive layer of the circuit.

Weshare Customized Solutions
We can customize raw materials, size, thickness, color, or special electrical and mechanical properties according to customer needs to ensure that each epoxy glass cloth laminate can perfectly adapt to your application environment. Please contact us immediately