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Good Price Cerium Oxide Glass Polishing Powder

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Min Order	1 Kg
Availability	In Stock
Shipping From	Jiangxi, China
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Ganzhou Wanfeng Advanced Materials Technology Co., Ltd.

Audited Supplier 9 years

Profile Certified by SGS/BV

Jiangxi, China
Wanfeng (Mr.)
Manager

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Model NO.:

REP-05S

Classification:

Cerium Oxide

Grade Standard:

Industrial Grade

Kind:

No Salt Oxide

Quality:

First Class

Trademark:

Wanfeng

Transport Package:

800kg, 850kg, 900kg or 1000kg Net Weight for Each

Specification:

D50: 1.7-2.3um

Origin:

China

Product Description

Good price Cerium Oxide Glass Polishing Powder

Specifications of Cerium Oxide Glass Polishing Powder:

*Appearance: white powder

*Code: REP-05

*TREO: ≥ 95%

*CeO₂/TREO: 70±5%

*La2O3/TREO : 30±5%

*Pr6O11/TREO : <0.01%

*F: 3-7%

*PH: 7

*Particle size: D50: 2.0±0.3 μm, D100<10μm

Code	TREO	CeO2	La2O3	Pr6O11	D50(μm)	D100(μm)	Color	F(%)	PH
REP-01	≥95%	70±5%	30±5%	<0.01%	0.6±0.2	<5	White	3-7	7
REP-02	≥95%	70±5%	30±5%	<0.01%	1.0±0.2	<6	White	3-7	7
REP-03	≥95%	70±5%	30±5%	<0.01%	1.3±0.3	<7	White	3-7	7
REP-04	≥95%	70±5%	30±5%	<0.01%	1.5±0.3	<8	White	3-7	7
REP-05	≥95%	70±5%	30±5%	<0.01%	2.0±0.3	<10	White	3-7	7
REP-06	≥95%	70±5%	30±5%	<0.01%	2.8±0.4	<12	White	3-7	7

REP-11	≥95%	65±5%	30±5%	1%~5%	0.6±0.2	<5	Red	3-7	7
REP-12	≥95%	65±5%	30±5%	1%~5%	1.0±0.2	<6	Red	3-7	7
REP-13	≥95%	65±5%	30±5%	1%~5%	1.3±0.3	<7	Red	3-7	7
REP-14	≥95%	65±5%	30±5%	1%~5%	1.5±0.3	<8	Red	3-7	7
REP-15	≥95%	65±5%	30±5%	1%~5%	2.0±0.3	<10	Red	3-7	7
REP-16	≥95%	65±5%	30±5%	1%~5%	2.8±0.4	<12	Red	3-7	7

REP-21	≥98%	≥99.95%	<0.03%	<0.01%	0.6±0.2	<5	White	0	7
REP-22	≥98%	≥99.95%	<0.03%	<0.01%	1.0±0.2	<6	White	0	7
REP-23	≥98%	≥99.95%	<0.03%	<0.01%	1.5±0.3	<8	White	0	7
REP-24	≥98%	≥99.95%	<0.03%	<0.01%	2.0±0.3	<10	White	0	7
REP-25	≥98%	≥99.95%	<0.03%	<0.01%	3.0±0.5	<15	White	0	7
REP-26	≥98%	≥99.95%	<0.03%	<0.01%	4.0±0.5	<20	White	0	7

Application of Cerium Oxide polishing powder :

1. For precision polishing of larger flat crystal and diamond products.
2. For the polishing of optical components and mobile covers with general precision requirements.
3. For the polishing of mobile phone covers, flat glass or optical glass with higher precision requirements. For example, the polishing of glass substrates for TFT-LCD.
4. For the precision polishing of optical components, silicon wafers and large glass covers with high precision requirements.
5. For the polishing of large flat glass, silicon wafers and optical glass with higher precision requirements.
6. For precision polishing of optical components with high precision requirements, or polishing of large LCD screen.