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High Deflection Gap Packing Tflex HD80000 Series Thermal Pad

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Min Order	1000 Pieces
Availability	In Stock
Shipping From	Guangdong, China
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Dongguan City U. One Electronic Technology Co., Ltd.

Audited Supplier 2 years

Profile Certified by SGS/BV

Guangdong, China
Shelly (Ms.)

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Model NO.:

Tflex HD80000

Certification:

RoHS, ISO9001

Type:

Thermally Pad

Material:

Thermally Pad

Form:

Thermal Element

Shape:

Sheet

Thermal Conductivity:

Color:

Teal

Product Thickness:

1.0~5.0mm

Temperature Range:

-400ºC~ 1500ºC

Trademark:

Laird

Transport Package:

Boxed

Specification:

Customized Size

Origin:

USA

Product Description

The High Deflection Gap Packing Tflex HD80000 Series thermal pad is a cutting-edge solution for thermal management in electronic devices. With its high deflection capability, this thermal pad is able to effectively fill gaps and provide optimal heat transfer between components. This ensures that electronic devices remain cool and perform at their best, even under heavy loads. The Tflex HD80000 Series is a reliable and efficient choice for engineers and designers looking to improve the thermal performance of their products. Its advanced design and high-quality materials make it a top choice for a wide range of applications.