High Performance Digital Mipi Camera Edp Circuit Boards Support NFC Card Reader Qr GPS G-Sensor Type-C 4G SIM Card PCBA PCB

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Ucreate PCB Co., Ltd.

VIP   Audited Supplier 11 years
Profile Certified by SGS/BV
  • Guangdong, China
  • Jason Guan (Mr.)  
    Business Manager
UC-02081700
Rigid Circuit Board
FR-4
Fiberglass Epoxy
Consumer Electronics
V0
Rigid
Electrolytic Foil
Copper
Epoxy Resin
UC
10
1.6mm
Fr4
Immersion Gold/HASL Lead Free/ Immersion Silve
Green/White/Black/Blue/Red
All 1 Oz
10 Working Days
UL(Us&Canada). ISO9001. RoHS, Ts, SGS
E-Testing, Flying Probe Testing
4 Working Days
UC
Vacuum Package
IPC class II
Shenzhen, China
8534001000
Product Description

 
                                        Ucreate LTD PCB's aim
 
                   Customer Satisfaction is Always Our First Priority!

 *Quality Policy 

           *Top Quality and high efficiency

                     *Improve continuously

                             *Achieve customer's satisfaction
 


1.Products Application



2. Market Distribution
 

 
 
3.Technical Capabilities
ItemsSpeci.Remark
Max panel size32" x 20.5"(800mm x 520mm) 
Min trace width/ space (inner layer)4mil/4mil(0.1mm/0.1mm) 
Min PAD (inner layer)5 mil(0.13mm)hole ring width
Min thickness(inner layer)4 mil(0.1mm)without copper
Inner copper thickness1~4 oz 
Outer copper thickness0.5~6 oz 
Finished board thickness0.4-3.2 mm 

Board thickness tolerance control
±0.10 mm±0.10 mm1~4 L
±10%±10%6~8 L
±10%±10%≥10 L
Inner layer treatmentbrown oxidation 
Layer count Capability1-30 LAYER 
alignment between ML±2mil 
Min drilling0.15 mm 
Min finished hole0.1 mm 
Hole precision±2 mil(±50 um) 
tolerance for Slot±3 mil(±75 um) 
tolerance for PTH±3 mil(±75um) 
tolerance for NPTH±2mil(±50um) 
Max Aspect Ratio for PTH8:1 
Hole wall copper thickness15-50um 
Alignment of outer layers4mil/4mil 
Min trace width/space for outer layer4mil/4mil 
Tolerance of Etching+/-10% 
Thickness of solder maskon trace0.4-1.2mil(10-30um) 
at trace corner≥0.2mil(5um) 
On base material≤+1.2mil
  Finished thickness
 
Hardness of solder mask6H 
Alignment of solder mask film±2mil(+/-50um) 
Min width of solder mask bridge4mil(100um) 
Max hole with solder plug0.5mm 
Surface finishHAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. 
Max Nickel thickness for Gold finger280u"(7um) 
Max gold thickness for Gold finger30u"(0.75um) 
Nickel thickness in Immersion Gold120u"/240u"(3um/6um) 
Gold thickness in Immersion Gold2u"/6u"(0.05um/0.15um) 
Impedance control and its tolerance50±10%,75±10%,100±10% 110±10% 
Trace Anti-stripped strength≥61B/in(≥107g/mm) 
bow and twist
 
0.75% 
 
4.Products Equipment
   

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