1)Alloy Designation,Chemical Composition
| Alloy Designation | Chemical Composition | |||||
| GB | UNS | EN | JIS | Cu +Ag% | Sn % | P % |
| QSn6.5-0.1 | C51900 | CuSn6 | C5191 | Rem. | 6.0-7.0 | 0.10-0.25 |
2)Physical properties,fabrication properties
| Physical properties | fabrication properties | ||||||||||
| Desity g/cm³ | Electrical conductivity %IACS | Thermal conductivity W(m.K) | Modulus of elasticity GPa | Specific heat J/(g.K) | Thermal expansion coefficien /K | Cold - workability | Hot - workability | Machinability | Electric plating property | Hot dip tin plating property | Weldability |
| 8.83 | 13 | 67 | 112 | 0.377 | 18 | Excellent | Limited | Less suitable | Excellent | Excellent | Good |
3)Mchine properties
| Mchine properties | |||||||||||
| Temper | Hardness | High precision bronze strip | Microcrystalline products | ||||||||
| Tensilent strength | Elongation | Thickness | Bend angle | Bend radius | Tensilent strength | Elongation | Thickness | Bend angle | Bend radius | ||
| 060 | ≤120 | ≥315 | ≥40 | <1.6 | 180°or W | Thickness*0.5 | - | - | - | 180° or W | Thickness*0.5 |
| H01 | 110-155 | 390-510 | ≥35 | Thickness*1 | - | - | - | Thickness*1 | |||
| H02 | 150-190 | 490-610 | ≥10 | Thickness*1.5 | - | - | - | Thickness*1.5 | |||
| H04 | 180-230 | 590-690 | ≥8 | Thickness*2 | 560-650 | ≥10 | 0.1-0.5 | Thickness*2 | |||
| H06 | 200-240 | 635-720 | ≥5 | - | - | - | ≥610 | ≥5 | 0.1-0.5 | - | - |
Widely used in high-tech electronic fields
such as computer CPU sockets,car terminals, mobile phone buttons, electronic connectors,etc.
i)Product introduction

ii)Equipment and workshop








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