Audited Supplier
FONIETO-1
Tin
SMT
1-22 Layers
FR-4
RoHS, CCC, ISO
Customized
New
Green;Red;Yellow;Black;White
No Limited
Retangular, Round, Slots, Cutouts, Complex, Irreg
HASL, Gold Finger, OSP, Enig, Peelable Mask
OEM, ODM
Inner Vacuum Packing Outer Carton Box
FR 4, 0.8mm, 1 Layer, 1OZ Copper Thickness
China
8534009000
Product Description
PCBA Production Capacity: Experience the pinnacle of technological sophistication and expert craftsmanship with our exceptional Printed Circuit Board Assembly (PCBA) production prowess. Our state-of-the-art facilities are meticulously crafted to cater to the dynamic and varied demands of numerous industries, providing unmatched innovation and bespoke solutions. We guarantee meticulous precision, steadfast reliability, and unmatched efficiency with every custom circuit board solution we offer. Each product is not merely crafted but ingeniously engineered to not just meet but far exceed your expectations, promising unparalleled quality and remarkable performance at its absolute best.
| Delivery time | Samples | 5pcs ~ 100pcs | 1 Day | All the above time starts after all components and PCB materials are ready |
| Small batch | 101pcs ~ 5000 pcs | 3 Days | ||
| Medium batch | 5001pcs ~ 10000 pcs | 5 Days | ||
| Large batch | >10001pcs | 15 Days | ||
| Production capacity | SMT 2 million points/day; DIP 250,000 points/day; 5-10 models/day | |||
| Component Range | Min. 01005(0.4mm*0.2mm) Max. 55mm(H25mm) | |||
| PCB Size | Min. 50mm*50mm (Suggest >100mm*100mm) Max. 460mm*1200mm | |||
| Max. Thickness | The batch size is not more than 3 mm, and the model is unlimited | |||
| Placement Accuracy | +/- 40 micrometer (Chip) +/- 30 micrometer (IC) | |||
| PCB Types | PCB rigid board (FR-4, metal substrate), PCB flexible board (FPC), soft and hard PCB | |||
| File Format | Bill of Materials (BOM), PCB files (Gerber files and PCB design format files), coordinate files | |||
| Solder paste tin wire tin bar | Lead-free solder paste, customed solder paste, Brand solder paste | |||
| Steel Mesh | Laser stencil IC and BGA components can reach PC-2 Class | |||
| Component Packaging | We accept SMT components in reel, cutting tape, tube, tray, etc. which can be packed on the machine. DIP components can be packed in bulk. | |||
| Component Purchase Service | 1 Foundry only (Customers provide PCB components) 2 Part of the substitute materials (customers provide core components and special components, we can purchase other components on behalf of us) 3 A full set of substitute materials (reduce purchase cost and communication cost) | |||
| Test | 1IQC: ncoming inspection. 2 IPQC: In-production inspection. 3 Visual QC: regular quality inspection. 4 On-line AOI: Check the soldering effect of solder paste, SMD components, few parts or component polarity. 5 X-Ray: Check BGA, QFN and other high-precision hidden PAD components. 6 Test function and performance according to customer's test procedures and steps. 7 Aging test: According to the customer's test time for aging. | |||
