K4A4G165WF-BCTD DRAM Chip DDR4 SDRAM 4Gbit 256Mx16 1.2V FBGA96

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Shenzhen Semilotec Co., Ltd.

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  • Guangdong, China
  • Zora Xu (Ms.)  
    Sales Manager
K4A4G165WF-BCTD
Bipolar Integrated Circuit
MSI
Semiconductor IC
new original
22+
FBGA96
Genuine New Original
hqfp64
Box
China
8542399000
Product Description

Description

K4A4G165WF-BCTD: DRAM Chip DDR4 SDRAM 4Gbit 256Mx16 1.2V 96-Pin FBGA

Mfr. Part#: K4A4G165WF-BCTD

Mfr.: 

Datasheet: (e-mail or chat us for PDF file)

ROHS Status: 

Quality: 100% Original

Warranty: ONE YEAR

 

EU RoHSCompliant 
ECCN (US)EAR99
Part StatusActive
HTS8542.32.00.36
AutomotiveNo
PPAPNo
DRAM TypeDDR4 SDRAM
Chip Density (bit)4G
Organization256Mx16
Number of Internal Banks16
Number of Words per Bank16M
Number of Bits/Word (bit)16
Data Bus Width (bit)16
Maximum Clock Rate (MHz)2666
Interface TypePOD
Minimum Operating Temperature (°C)0
Maximum Operating Temperature (°C)85
Supplier Temperature GradeCommercial
Number of I/O Lines (bit)16
MountingSurface Mount
Package Height0.98(Max)
Package Width10.3
Package Length13.3
PCB changed96
Standard Package NameBGA
Supplier PackageFBGA
Pin Count96
Lead ShapeBall

 

The 4Gb DDR4 SDRAM F-die is organized as a 32Mbit x 16 I/Os x 8banks device. This synchronous device achieves high speed double-data-rate transfer rates of up to 3200Mb/sec/pin (DDR4-3200) for general applications. The chip is designed to comply with the following key DDR4 SDRAM features such as posted CAS, Programmable CWL, Internal (Self) Calibration, On Die Termination using ODT pin and Asynchronous Reset. All of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the crosspoint of differential clocks (CK rising and CK falling). All I/Os are synchronized with a pair of bidirectional strobes (DQS and DQS) in a source synchronous fashion. The address bus is used to convey row, column, and bank address information in a RAS/CAS multiplexing style. The DDR4 device operates with a single 1.2V (1.14V~1.26V) power supply, 1.2V(1.14V~1.26V) VDDQ and 2.5V (2.375V~2.75V) VPP. The 4Gb DDR4 F-die device is available in 96ball FBGAs(x16).


 






















 

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  • Located in Shenzhen, the electronic market center of China.
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  • Sufficient stock on your urgent demand.
  • Sophisticated colleagues help you solve problems to reduce your risk with on-demand manufacturing
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  • 24 Hours service 

 

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