Audited Supplier
MoCu
Aviation, Electronics, Industrial, Medical, Chemical
GB, ASTM
as Required
Alloy
Molybdenum Plate
Not Powder
Professional
as Required
Ground Polished
10-15 Days
ISO9001:2000
tongchang
Wooden Boxes
as required
China
8102950000
Product Description
The main characteristics of molybdenum copper alloy: low gas content and good vacuum performance. Regardless of whether it is molybdenum or copper, its oxides are very easy to recover,so as to maintain extremely low outgassing under vacuum and have good vacuum performance. Good machinability. Pure molybdenum metal itself is difficult to machine due to its higher hardness and brittleness. The molybdenum-copper alloy reduces the hardness of the material and increases the plasticity after adding copper, and the molybdenum-copper alloy rod is advantageous for machining and can be processed into parts with complex shapes.
Molybdenum-copper alloy combines the advantages of copper and molybdenum, high strength, high specific gravity, high temperature resistance, arc ablation resistance, good electrical conductivity and heating performance, and good processing performance. Using high-quality molybdenum powder and oxygen-free copper powder, applying isostatic pressing (high temperature sintering-copper infiltration) to ensure product purity and accurate ratio, fine structure, excellent performance. Good arc breaking performance, good electrical conductivity, and good thermal conductivity,thermal expansion is small.
Molybdenum-copper alloy combines the advantages of copper and molybdenum, high strength, high specific gravity, high temperature resistance, arc ablation resistance, good electrical conductivity and heating performance, and good processing performance. Using high-quality molybdenum powder and oxygen-free copper powder, applying isostatic pressing (high temperature sintering-copper infiltration) to ensure product purity and accurate ratio, fine structure, excellent performance. Good arc breaking performance, good electrical conductivity, and good thermal conductivity,thermal expansion is small.
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