Audited Supplier
Various
Bare
Gold
Microelectronics, LED Packaging, IC Packaging
Gold
Round Wire
Microelectronics, LED Packaging, IC Packaging
ISO9001, CE, CCC, RoHS
Has Good Mechanical Strength
Corrosion Resistance and Heat Resistance Strength
Has Good Conductivity
Electrolysis and Catalysis
99.999%
Bubble Chamber, Paper Box
Various
China
Product Description
| Key | Description |
|---|---|
| 1. Conductivity | Key gold wires need to have good electrical conductivity to ensure the reliability and stability of signal transmission. Different materials of key gold wires vary in electrical conductivity. |
| 2. Solderability | Key gold wires need to have good solderability to ensure a reliable connection with chip pins or packaging substrates. Different materials and diameters of key gold wires also vary in solderability. |
| 3. Reliability | Key gold wires need to have good reliability, capable of withstanding the impact of environmental factors such as temperature, humidity, and mechanical stress, maintaining stable connections and not easily breaking. |
| 4. Size and Diameter | The size and diameter of key gold wires are crucial for chip packaging processes. Appropriate diameters and lengths of key gold wires need to be selected for different packaging processes and application scenarios. |
| 5. Main Uses in Electronic Packaging | Key gold wires have several important uses in electronic packaging, which are detailed below: |
| 6. Chip and Pin Connections | Key gold wires are widely used for connections between chips and pins, achieving electrical connections between chips and packaging substrates through soldering or pressure welding. This is one of the most common and critical applications in the chip packaging process. |
| 7. Internal Chip Interconnections | In some highly integrated chips, to achieve interconnections between various functional modules, key gold wires are used for internal interconnections. Different functional modules are interconnected by winding or passing the metal wire through the internal structure of the chip to achieve signal transmission. |
| 8. Packaging Substrate Connections | Key gold wires are also used to connect chips to packaging substrates. Through soldering or pressure welding, the key gold wire is connected to the packaging substrate to achieve a connection between the chip and the external circuit. |
| 9. Optical Packaging | In the field of optical communication, key gold wires are widely used in the packaging process of optoelectronic devices. By bonding optical fibers and other optical components with chips, the input and output of optical signals are achieved. |
Shenzhen Silver Technologies Ltd mainly acts as an agent, develops, produces and sells packaging tools and materials such as single crystal copper, copper alloy, key alloy wire, gold palladium copper wire, alloy wire, super-soft copper wire, packaged gold tape, pure aluminum wire, cleaver, steel nozzle, film, etc. At the same time, it can also tailor products with special parameters and requirements for enterprises.
Products of each project team:
1. High purity metal (pure platinum wire, pure gold particles, high purity silver wire, high purity single crystal copper)
2. Precious metal alloys (platinum iridium, platinum rhodium, gold and silver, gold and silver palladium, copper palladium, silver palladium, gold and tin alloys)
3. Copper alloy (silver copper alloy, tin copper alloy)
4. Stranded enameled wire (polyimide, polyurethane )
5. Semiconductor materials (key alloy belt, key alloy wire, gold palladium copper wire, pure aluminum wire, steel nozzle, cleaver)
6. Imported chips (Infineon, Ansemy, ST, TI)
Products of each project team:
1. High purity metal (pure platinum wire, pure gold particles, high purity silver wire, high purity single crystal copper)
2. Precious metal alloys (platinum iridium, platinum rhodium, gold and silver, gold and silver palladium, copper palladium, silver palladium, gold and tin alloys)
3. Copper alloy (silver copper alloy, tin copper alloy)
4. Stranded enameled wire (polyimide, polyurethane )
5. Semiconductor materials (key alloy belt, key alloy wire, gold palladium copper wire, pure aluminum wire, steel nozzle, cleaver)
6. Imported chips (Infineon, Ansemy, ST, TI)
